Method of manufacturing multilayer device

Abstract

A method of manufacturing a multilayer device performs a first forming step, a second forming step, and a joining step. In the first forming step, a cutting site is formed at a first joining target provided with a plurality of chip regions while the first joining target is held by a first holding sheet. The cutting site is used for singulating the chip regions of the first joining target individually. In the second forming step, a cutting site is formed at a second joining target provided with a plurality of chip regions while the second joining target is held by a second holding sheet. The cutting site is used for singulating the chip regions of the second joining target individually. In the joining step, the first joining target and the second joining target are joined in such a manner that the respective chip regions of the first joining target and the second joining target are stacked on each other in a predetermined positional relationship therebetween by moving the first holding sheet and the second holding sheet relative to each other.

Dependencies are inferred from the claim text.