H10P 72/7408
The auxiliary support including alignment aids
Official title: {the auxiliary support including alignment aids}
H10P72/7408 (The auxiliary support including alignment aids) appears on 169 US grants and 241 published applications in this corpus.
Search patents in H10P- Granted patents
- 169
- Published applications
- 241
- Assignees
- 107
- Inventors
- 470
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 4 |
| 2006 | 2 | 4 |
| 2007 | 1 | 1 |
| 2008 | 3 | 6 |
| 2009 | 4 | 2 |
| 2010 | 1 | 1 |
| 2011 | 1 | 3 |
| 2012 | 2 | 1 |
| 2013 | 2 | 2 |
| 2014 | 1 | 3 |
| 2015 | 2 | 1 |
| 2016 | 2 | 2 |
| 2017 | 2 | 6 |
| 2018 | 4 | 5 |
| 2019 | 7 | 21 |
| 2020 | 13 | 26 |
| 2021 | 16 | 30 |
| 2022 | 25 | 33 |
| 2023 | 19 | 28 |
| 2024 | 19 | 19 |
| 2025 | 27 | 28 |
| 2026 | 10 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device18 Aug 2026US 12,713,908 B2Samsung Electronics Co., Ltd.
- Semiconductor device carriers and methods of making and using26 May 2026US 12,642,051 B2UTAC Headquarters Pte. Ltd.
- Apparatus for processing of singulated dies and methods for using the same5 May 2026US 12,622,222 B2Adeia Semiconductor Bonding Technologies Inc.
- Method for forming semiconductor packages using dielectric alignment marks and laser liftoff process21 Apr 2026US 12,610,845 B2Tokyo Electron Limited
- Semiconductor encapsulation method and semiconductor encapsulation structure21 Apr 2026US 12,610,846 B2CR Runan Technologies (Chongqing) Co. Ltd.
- Semiconductor chip protect film17 Sep 2026US 2026/0282835 A1Samsung Electronics Co., Ltd.
- Semiconductor Device Carriers and Methods of Making and Using10 Sep 2026US 2026/0271667 A1UTAC Headquarters Pte. Ltd.
- Methods of manufacturing device packages using singulated die carriers13 Aug 2026US 2026/0239922 A1Adeia Semiconductor Bonding Technologies Inc.
- Assembly substrate2 Jul 2026US 2026/0190560 A1LG Display Co., Ltd.
- Semiconductor package and manufacturing method for the same21 May 2026US 2026/0144068 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Process for lift off and handling of thin film materials128US 6,214,733 B1ELO Technologies, Inc. · 2001
- Interlocking and invertible semiconductor device tray and test contactor mating thereto76US 5,492,223 AMotorola, Inc. · 1996
- Tray for integrated circuits with supporting ribs69US 5,103,976 AR. H. Murphy Co., Inc. · 1992
- Linked container for transporting precision devices27US 5,333,733 AGold Industries Co., Ltd. · 1994
- Wiring board and method for manufacturing the same24US 7,525,814 B2Ngk Spark Plug Co., Ltd. · 2009