Interlocking and invertible semiconductor device tray and test contactor mating thereto

A tray for handling a semiconductor device encapsulated in a packaged body and having multiple leads projecting from an edge of the package body, comprising:

• a support frame having a first side and a second opposing side;
• a cell in the support frame for holding a semiconductor device encapsulated in a package body, the cell being capable of retaining the semiconductor device on the first and second side, wherein the cell has a device-capture surface on the second side that is substantially a same size as a perimeter of a first surface of the package body, the cell being defined on the first side by outer peripheral sidewalls having a lead-in-chamfer at a first angle to guide the semiconductor device into the cell;
• a pedestal inside the cell for supporting a second surface of the package body of the semiconductor device;
• a body retaining fence connected to a portion of a perimeter of the pedestal to retain the package body of the semiconductor device;
• a trough separating the pedestal and the outer peripheral sidewalls to accommodate the leads of the semiconductor device;
• and
• an interlocking nest feature around a portion of a perimeter of the device-capture surface, the interlocking nest feature having an external chamfer at a second angle to mate with the first angle and a device-retaining chamber at a third angle retain the package body;
• wherein when first and second substantially identical trays are stacked with one another, the interlocking nest feature of the first tray nests into the cell of the second tray to interlock the first and second trays.

A tray for handling a semiconductor device encapsulated in a package body and having multiple leads projecting from an edge of the package body, comprising:

• a support frame having a first side and a second opposing side;
• a cell in the support frame for holding a semiconductor device encapsulated in a package body, the cell being capable of retaining the semiconductor device on the first and second side, wherein the cell has a device-capture surface on the second side that is substantially a same size as a perimeter of a first surface of the package body, the cell being defined on the first side by outer peripheral sidewalls having a lead-in-chamfer at a first angle to guide the semiconductor device into the cell;
• a pedestal inside the cell for supporting a second surface of the package body of the semiconductor device;
• a trough separating the pedestal and the outer peripheral sidewalls to accommodate the leads of the semiconductor device;
• an interlocking nest feature around a portion of a perimeter of the device-capture surface, the interlocking nest feature having an external chamfer at a second angle to mate with the first angle and a device-retaining chamfer at a third angle retain the package body;
• and
• an upper body retaining fence connected to a portion of the device-retaining chamfer to retain the package body of the semiconductor device;
• wherein when first and second substantially identical trays are stacked with one another, the interlocking nest feature of the first tray nests into the cell of the second tray to interlock the first and second trays.

A tray for handling a semiconductor device encapsulated in a package body and having an area array of external electrical connections projecting from a surface of the package body, comprising:

• a support frame having a first side and a second opposing side;
• a cell in the support frame for holding a semiconductor device encapsulated in a package body, the cell being capable of retaining the semiconductor device on the first and second side, wherein the cell has a device-capture surface on the second side having a perimeter which has a side, the perimeter of the device-capture surface being substantially a same size as a perimeter of a first surface of the package body, the cell being defined on the first side by outer peripheral sidewalls having a lead-in-chamfer at a first angle to guide the semiconductor device into the cell;
• body retaining means inside the cell for supporting a portion of the package body of the semiconductor device;
• and
• an interlocking nest feature around a portion of each side of the perimeter of the device-capture surface, the interlocking nest feature having an external chamfer at a second angle to mate with the first angle and a device-retaining chamfer at a third angle retain the package body;
• wherein when first and second substantially identical trays are stacked with one another, the interlocking nest feature of the first tray nests into the cell of the second tray to interlock the first and second trays.

A tray for handling a semiconductor device encapsulated in a package body and having an area array of external electrical connections projecting from a surface of the package body, comprising:

• a support frame having a first side and a second opposing side;
• a cell in the support frame for holding a semiconductor device encapsulated in a package body, the cell being capable of retaining the semiconductor device on the first and second side, wherein the cell has a device-capture surface on the second side that is substantially a same size as a perimeter of a first surface of the package body, the cell being defined on the first side by outer peripheral sidewalls having a lead-in-chamfer at a first angle to guide the semiconductor device into the cell;
• body retaining means inside the cell for supporting a portion of the package body of the semiconductor device;
• an interlocking nest feature around a portion of a perimeter of the device-capture surface, the interlocking nest feature having an external chamfer at a second angle to mate with the first angle and a device-retaining chamfer at a third angle retain the package body;
• and
• an upper body retaining fence connected to a portion of the device-retaining chamfer to retain the package body of the device;
• wherein when first and second substantially identical trays are stacked with one another, the interlocking nest feature of the first tray nests into the cell of the second tray to interlock the first and second trays.