Semiconductor chip protect film
AssigneeSamsung Electronics Co., Ltd.
InventorsDu Sik Jung, Yun Seok Choi
Life of this patent
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Abstract
A semiconductor chip protection film is provided. A semiconductor chip protection film comprises a plurality of sub-films which are attached to a wafer; and a carrier which carries the plurality of sub-films, wherein at least one of the sub-films and the carrier includes a film alignment mark on an upper side, the wafer has a die alignment mark on an upper side, the sub-films are attached at a first position on the wafer, and the first position is a position at which the film alignment mark and the die alignment mark overlap in a first direction.
Claims20
A semiconductor chip protection film comprising:
- a plurality of sub-films which are attached to a wafer;
- and
- a carrier which carries the plurality of sub-films,
- wherein at least one of the sub-films and the carrier includes a film alignment mark on an upper side,
- the wafer has a die alignment mark on an upper side,
- the sub-films are attached at a first position on the wafer, and
- the first position is a position at which the film alignment mark and the die alignment mark overlap in a first direction.
A semiconductor chip protection film which is attached to a semiconductor chip, and includes a film alignment mark on an upper side,
- wherein:
- the semiconductor chip has a die alignment mark on an upper side, and
- the film alignment mark and the die alignment mark overlap in a first direction.
A semiconductor chip protection film comprising:
- a plurality of sub-films which are attached to a wafer including a plurality of semiconductor chips;
- and
- a carrier which carries the plurality of sub-films,
- wherein:
- the carrier includes a film alignment mark on an upper side,
- the wafer has a die alignment mark on an upper side, and
- the film alignment mark and the die alignment mark overlap in the first direction.
Dependencies are inferred from the claim text.