Semiconductor encapsulation method and semiconductor encapsulation structure

A semiconductor packaging method, comprising:

• forming a protective layer on a front side of a chip to be packaged, wherein the protective layer is made of an organic-inorganic composite material;
• attaching the chip to be packaged, with the protective layer formed on the front side thereof, to a carrier substrate in such a manner that the front side of the chip to be packaged faces upward and a back side of the chip to be packaged faces the carrier substrate;
• and
• forming a plastic encapsulation layer to entirely encapsulate the chip to be packaged and the protective layer on the carrier substrate,
• wherein the plastic encapsulation layer is made of an organic-inorganic composite material, the organic-inorganic composite material of the protective layer and the organic-inorganic composite material of the plastic encapsulation layer each comprising an organic material and filler particles dispersed in the organic material, the organic-inorganic composite material of the protective layer is able to effectively mitigate discrepancies between the chip to be packaged and the protective layer in terms of material properties,
• wherein the filler particles in the protective layer and the filler particles in the plastic encapsulation layer are each made of an inorganic material and are spherical, a particle size of the filler particles in the protective layer is smaller than a particle size of the filler particles in the plastic encapsulation layer,
• wherein the filler particles in the protective layer are present at an amount ranging from 50 w.t. % to 95 w.t. %, which enables the protective layer to be closer to silicon in terms of the material properties.