Semiconductor device carriers and methods of making and using
AssigneeUTAC Headquarters Pte. Ltd.
InventorsRoel Adeva Robles, Chee Kay Chow
Life of this patent
Estimating the term…
Abstract
A first carrier has a first plate. A tape is disposed on the first plate. A second plate is disposed over the first plate. The second plate has a trench aligned to the tape and an opening formed through the second plate over the tape. A singulated semiconductor package is disposed on the tape in the opening of the second plate. A second carrier has a static datum and a movable datum. The movable datum is moved toward the static datum. An aperture substrate is disposed around the static datum and movable datum. A manufacturing process is performed on the aperture substrate.
Claims17
A method of making a semiconductor device, comprising:
- providing a first plate including a first opening and a second opening formed through the first plate;
- disposing a tape on the first plate between the first opening and second opening;
- disposing a second plate over the first plate, wherein the second plate has,
- a trench aligned to the tape, wherein a first thickness of the second plate within the trench is less than a second thickness of the second plate adjacent to the trench, and wherein the tape is disposed in the trench while the second plate physically contacts the first plate adjacent to the trench, and
- a third opening formed through the second plate in the trench over the tape;
- disposing a singulated semiconductor package on the tape in the opening of the second plate, wherein the semiconductor package extends outside a footprint of the tape to overlap the first opening and second opening;
- and
- demounting the semiconductor package by inserting a tool through the first opening and second opening of the first plate.
A method of making a semiconductor device, comprising:
- providing a carrier including a static datum and a movable datum, wherein the movable datum is slidably coupled to the carrier and configured to slide linearly in a direction parallel to a top surface of the carrier;
- moving the movable datum toward the static datum;
- disposing an aperture substrate around the static datum and movable datum with the static datum and movable datum both within an opening of the aperture substrate;
- releasing the movable datum after disposing the aperture substrate around the static datum and movable datum, wherein the movable datum moves away from the static datum to apply a pressure against internal surfaces of the opening of the aperture substrate;
- and
- performing a manufacturing process on the aperture substrate after releasing the movable datum.
A carrier for manufacturing a semiconductor device, comprising:
- a plate;
- a static datum attached to the plate in a fixed position;
- a movable datum slidably attached to the plate, wherein the movable datum is configured to slide linearly in a direction parallel to a top surface of the plate;
- a spring coupled between the plate and the movable datum, wherein the spring is configured to push the movable datum away from the static datum;
- and
- a pin jig disposed under the plate, wherein the pin jig includes a pin extending through an opening of the movable datum.
Dependencies are inferred from the claim text.