H10P 72/78
Using vacuum or suction
Official title: using vacuum or suction, e.g. Bernoulli chucks
H10P72/78 (Using vacuum or suction) appears on 2,495 US grants and 2,941 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,495
- Published applications
- 2,941
- Assignees
- 887
- Inventors
- 5,759
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 6 | 0 |
| 1985 | 14 | 0 |
| 1986 | 11 | 0 |
| 1987 | 12 | 0 |
| 1988 | 17 | 0 |
| 1989 | 15 | 0 |
| 1990 | 14 | 0 |
| 1991 | 14 | 0 |
| 1992 | 16 | 0 |
| 1993 | 14 | 0 |
| 1994 | 23 | 0 |
| 1995 | 18 | 0 |
| 1996 | 18 | 0 |
| 1997 | 20 | 0 |
| 1998 | 29 | 0 |
| 1999 | 39 | 0 |
| 2000 | 56 | 0 |
| 2001 | 65 | 16 |
| 2002 | 47 | 56 |
| 2003 | 60 | 78 |
| 2004 | 53 | 69 |
| 2005 | 42 | 54 |
| 2006 | 41 | 64 |
| 2007 | 36 | 56 |
| 2008 | 28 | 64 |
| 2009 | 30 | 51 |
| 2010 | 39 | 62 |
| 2011 | 38 | 59 |
| 2012 | 48 | 70 |
| 2013 | 50 | 90 |
| 2014 | 70 | 77 |
| 2015 | 56 | 98 |
| 2016 | 78 | 98 |
| 2017 | 90 | 131 |
| 2018 | 78 | 160 |
| 2019 | 116 | 175 |
| 2020 | 152 | 196 |
| 2021 | 150 | 202 |
| 2022 | 164 | 226 |
| 2023 | 158 | 233 |
| 2024 | 163 | 223 |
| 2025 | 170 | 196 |
| 2026 | 119 | 137 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Thermal treatment apparatus, thermal treatment method, and storage medium6 Oct 2026US 12,757,670 B2Tokyo Electron Limited
- Substrate handling apparatus for extreme warped wafers6 Oct 2026US 12,757,686 B2KLA Corporation
- Pick-and-place tool with warpage-correction mechanism22 Sep 2026US 12,745,603 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer holder device having heating function15 Sep 2026US 12,740,365 B2Sky Tech Inc.
- Manufacturing method of the semiconductor package8 Oct 2026US 2026/0314301 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mass transfer apparatus and mass transfer method thereof8 Oct 2026US 2026/0314318 A1Century Technology (Shenzhen) Corporation Limited
- Wafer release mechanism8 Oct 2026US 2026/0314329 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate chucking assist module8 Oct 2026US 2026/0314330 A1APPLIED Materials.Inc.
- Substrate holding apparatus, substrate processing apparatus, separation method, and article manufacturing method1 Oct 2026US 2026/0299438 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Device and method for handling substrates by means of a self-leveling vacuum system in epitaxial induction554US 6,648,974 B1Lpe S.P.A. · 2003
- Heating apparatus, heating method, and computer readable storage medium547US 7,992,318 B2Tokyo Electron Limited · 2011
- Ultra low contact area end effector545US 7,055,875 B2Asyst Technologies, Inc. · 2006
- Suction structure, robot hand and robot532US 8,991,887 B2Kabushiki Kaisha Yaskawa Denki · 2015
- Heat process apparatus and heat process method514US 6,129,546 ATokyo Electron Limited · 2000