Manufacturing method of the semiconductor package

A manufacturing method of a semiconductor package, comprising:

• moving a pick and place device toward a semiconductor device on a carrier, wherein the pick and place device comprises a flexible head having a bonding portion configured to be coupled to the semiconductor device, and a neck portion connecting the bonding portion, wherein the neck portion has an inwardly recessed side surface;
• picking up the semiconductor device from the carrier by providing a vacuum between the flexible head and the semiconductor device;
• placing and pressing the semiconductor device onto a substrate by the pick and place device;
• providing an air flow toward the semiconductor device to release the vacuum between the flexible head and the semiconductor device;
• and
• moving the pick and place device away from the semiconductor device.

A manufacturing method of a semiconductor package, comprising:

• picking up a semiconductor device from a carrier by a pick and place device, wherein the pick and place device comprises a flexible head comprises a groove surrounding a perimeter of the flexible head and a plurality of channels extending through the flexible head;
• placing and pressing the semiconductor device onto a substrate by the flexible head;
• providing an air flow toward the semiconductor device through the plurality of channels and pushing the semiconductor device toward the substrate;
• and
• moving the pick and place device away from the semiconductor device.