Substrate handling apparatus for extreme warped wafers
AssigneeKLA Corporation
InventorsBalajee Raghavan, Andrey Yakovlev
Life of this patent
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AssigneeKLA Corporation
InventorsBalajee Raghavan, Andrey Yakovlev
Estimating the term…
A substrate handling apparatus is provided. The substrate handling apparatus may include a forked structure with one or more support portions which are arranged to provide access to a back surface of a substrate. The substrate handling apparatus may also include a first active support element and a second active support element configured to couple the substrate handling apparatus to the back surface of the substrate. After being placed on the first active support element and the second active support element, the substrate may tilt or lean to create at least a third, passive point of contact along the forked structure. The creation of at least a third, passive point of contact may increase substrate handling and control capabilities with warped substrates.
A substrate handling apparatus comprising:
A substrate handling apparatus comprising:
A system comprising:
Dependencies are inferred from the claim text.