Wafer holder device having heating function
AssigneeSky Tech Inc.
InventorsJung-Hua Chang, Ta-Hao Kuo
Life of this patent
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Abstract
A wafer holder device having a heating function includes a fixing ring, a holder plate, and a heating plate. The fixing ring surrounds a hollow area, and the fixing ring includes a top and a bottom. The hollow area connects the top and the bottom. The holder plate includes a holding surface and a bottom surface. The holder plate is removably fixed to the top of the fixing ring, and the bottom surface of the holder plate covers the hollow area. A coefficient of thermal expansion of the holder plate is smaller than a coefficient of thermal expansion of the fixing ring. The heating plate is provided within the hollow area for heating the bottom surface of the holder.
Claims10
A wafer holder device having a heating function, comprising:
- a fixing ring surrounding a hollow area and having a top and a bottom;
- wherein the hollow area connects the top and the bottom;
- a holder plate having a holding surface and a bottom surface;
- wherein the holder plate is removably fixed to the top of the fixing ring and the bottom surface of the holder plate covers the hollow area;
- wherein a coefficient of thermal expansion of the holder plate is smaller than a coefficient of thermal expansion of the fixing ring;
- and
- a heating plate provided within the hollow area for heating the bottom surface of the holder plate.
Dependencies are inferred from the claim text.