Pick-and-place tool with warpage-correction mechanism

A suction head of a pick-and-place tool for semiconductor device packaging, the suction head comprising:

• a suction unit configured to apply a suction force on a top die and pick and hold the top die;
• and
• a warpage-correction mechanism, wherein the warpage-correction mechanism comprises a pushing mechanism, and the pushing mechanism comprises a plurality of pushing units, each of the plurality of pushing units disposed in a corner region of the suction head, wherein each of the plurality of pushing units comprises:
• a tubular chamber extending vertically relative to a bottom surface of the suction head;
• and
• a pusher disposed in the tubular chamber and in air-tight contact with a side wall of the tubular chamber, wherein the pusher is movable vertically and capable of protruding out of the bottom surface of the suction head to push a corner region of the top die and apply a downward force thereon to press the top die against a bottom die, wherein the pusher is configured to be driven by a pressurized gas flow.