Semiconductor manufacturing apparatus and semiconductor device manufacturing method

A semiconductor manufacturing apparatus comprising:

• a chamber including a top plate;
• a holder provided in the chamber and configured to place a substrate;
• a high-frequency power source configured to apply high-frequency power to the holder;
• a gas supply pipe configured to supply a gas to the chamber;
• a gas discharge pipe configured to discharge a gas from the chamber;
• a plurality of lift pins configured to move the substrate in a direction away from the holder to the top plate, which allows tip ends of the lift pins to move from an upper surface of the holder to a position with a first distance, wherein the first distance is equal to or greater than about 70% of a second distance between the upper surface of the holder and the top plate;
• and
• a plurality of push pins configured to push down the substrate in a direction away from the top plate to the holder while the substrate is supported by the lift pins.