H10P 72/76
Using mechanical means
Official title: using mechanical means, e.g. clamps or pinches
H10P72/76 (Using mechanical means) appears on 8,785 US grants and 11,678 published applications in this corpus.
Search patents in H10P- Granted patents
- 8,785
- Published applications
- 11,678
- Assignees
- 1,480
- Inventors
- 17,008
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 7 | 0 |
| 1984 | 7 | 0 |
| 1985 | 8 | 0 |
| 1986 | 14 | 0 |
| 1987 | 8 | 0 |
| 1988 | 17 | 0 |
| 1989 | 19 | 0 |
| 1990 | 25 | 0 |
| 1991 | 28 | 0 |
| 1992 | 39 | 0 |
| 1993 | 37 | 0 |
| 1994 | 34 | 0 |
| 1995 | 47 | 0 |
| 1996 | 33 | 0 |
| 1997 | 48 | 0 |
| 1998 | 73 | 0 |
| 1999 | 85 | 0 |
| 2000 | 125 | 0 |
| 2001 | 123 | 44 |
| 2002 | 121 | 159 |
| 2003 | 134 | 207 |
| 2004 | 143 | 194 |
| 2005 | 115 | 193 |
| 2006 | 102 | 203 |
| 2007 | 96 | 247 |
| 2008 | 83 | 288 |
| 2009 | 101 | 227 |
| 2010 | 158 | 264 |
| 2011 | 164 | 235 |
| 2012 | 182 | 280 |
| 2013 | 195 | 296 |
| 2014 | 234 | 315 |
| 2015 | 242 | 368 |
| 2016 | 263 | 411 |
| 2017 | 306 | 548 |
| 2018 | 385 | 685 |
| 2019 | 505 | 748 |
| 2020 | 603 | 908 |
| 2021 | 601 | 853 |
| 2022 | 664 | 979 |
| 2023 | 640 | 907 |
| 2024 | 696 | 777 |
| 2025 | 749 | 790 |
| 2026 | 508 | 552 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate processing apparatus6 Oct 2026US 12,753,507 B2Tokyo Electron Limited
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Wafer processing method6 Oct 2026US 12,757,662 B2Disco Corporation
- Heating/cooling device and heating/cooling method6 Oct 2026US 12,757,671 B2Tokyo Electron Limited
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Transfer robot8 Oct 2026US 2026/0307918 A1Kabushiki Kaisha Yaskawa Denki
- Rotary electrical feedthrough integration for process chamber8 Oct 2026US 2026/0308750 A1APPLIED Materials.Inc.
- Reactant vapor delivery systems for semiconductor processing tools and methods8 Oct 2026US 2026/0308757 A1ASM IP Holding B. V.
- System and method to maintain constant clamping pressure during chamber rebooting and power failure instances8 Oct 2026US 2026/0311974 A1Lam Research Corporation
Most cited
By later US patents
- Transportation apparatus and drive mechanism1,050US 7,837,425 B2Tokyo Electron Limited · 2010
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Wafer support system670US 6,053,982 AASM America, Inc. · 2000
- Susceptor drive and wafer displacement mechanism660US 5,421,893 AAPPLIED Materials.Inc. · 1995