H10P 72/7602
The wafers being placed on a robot blade or gripped by a
Official title: {the wafers being placed on a robot blade or gripped by a gripper for conveyance}
H10P72/7602 (The wafers being placed on a robot blade or gripped by a) appears on 2,080 US grants and 2,486 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,080
- Published applications
- 2,486
- Assignees
- 580
- Inventors
- 4,572
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 6 | 0 |
| 1987 | 6 | 0 |
| 1988 | 9 | 0 |
| 1989 | 11 | 0 |
| 1990 | 19 | 0 |
| 1991 | 22 | 0 |
| 1992 | 24 | 0 |
| 1993 | 13 | 0 |
| 1994 | 9 | 0 |
| 1995 | 21 | 0 |
| 1996 | 12 | 0 |
| 1997 | 18 | 0 |
| 1998 | 24 | 0 |
| 1999 | 23 | 0 |
| 2000 | 38 | 0 |
| 2001 | 47 | 16 |
| 2002 | 37 | 63 |
| 2003 | 57 | 69 |
| 2004 | 47 | 63 |
| 2005 | 42 | 65 |
| 2006 | 47 | 69 |
| 2007 | 34 | 68 |
| 2008 | 24 | 60 |
| 2009 | 30 | 47 |
| 2010 | 46 | 42 |
| 2011 | 42 | 44 |
| 2012 | 29 | 64 |
| 2013 | 40 | 55 |
| 2014 | 57 | 51 |
| 2015 | 49 | 70 |
| 2016 | 74 | 77 |
| 2017 | 48 | 92 |
| 2018 | 68 | 103 |
| 2019 | 90 | 130 |
| 2020 | 121 | 187 |
| 2021 | 109 | 170 |
| 2022 | 139 | 208 |
| 2023 | 129 | 189 |
| 2024 | 151 | 154 |
| 2025 | 137 | 176 |
| 2026 | 123 | 154 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Heating/cooling device and heating/cooling method6 Oct 2026US 12,757,671 B2Tokyo Electron Limited
- Substrate handling apparatus for extreme warped wafers6 Oct 2026US 12,757,686 B2KLA Corporation
- Container, container partition plate, substrate processing system, and substrate transfer method29 Sep 2026US 12,751,241 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method29 Sep 2026US 12,751,246 B2Tokyo Electron Limited
- Optically activated object mass transfer using multiple optical energy sources29 Sep 2026US 12,751,252 B2Genesee Valley Innovations, LLC
- Transfer robot8 Oct 2026US 2026/0307918 A1Kabushiki Kaisha Yaskawa Denki
- Pre-clean chamber assembly architecture for improved serviceability8 Oct 2026US 2026/0314294 A1APPLIED Materials.Inc.
- Substrate processing method and substrate processing apparatus8 Oct 2026US 2026/0314296 A1SCREEN Holdings Co., Ltd.
- Synchronized multi-arm robot8 Oct 2026US 2026/0314323 A1Tokyo Electron Limited
- Substrate processing apparatus8 Oct 2026US 2026/0314328 A1SCREEN Holdings Co., Ltd.
Most cited
By later US patents
- Transportation apparatus and drive mechanism1,050US 7,837,425 B2Tokyo Electron Limited · 2010
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Wafer transfer mechanism548US 6,305,898 B1ASM Japan K .K. · 2001
- Ultra low contact area end effector545US 7,055,875 B2Asyst Technologies, Inc. · 2006
- Clamping device and workpiece conveying robot544US 8,764,085 B2Sinfonia Technology Co., Ltd. · 2014