Substrate processing method and substrate processing apparatus

A substrate processing method, comprising:

• transferring, by a second transfer mechanism, a substrate with a cleaning jig having been cleaned in a processing unit from the processing unit to a substrate placement section as a post-processing substrate;
• separating the post-processing substrate into the cleaning jig and the substrate in the substrate placement section;
• transferring, by a first transfer mechanism, the substrate from the substrate placement section to a substrate accommodating section;
• and
• transferring, by the second transfer mechanism, the cleaning jig from the substrate placement section to a cleaning jig accommodating section.

A substrate processing apparatus, comprising:

• a substrate placement section;
• a first transfer mechanism;
• and
• a second transfer mechanism,
• the first transfer mechanism transferring a substrate between a substrate accommodating section and the substrate placement section,
• the second transfer mechanism transferring a cleaning jig between a cleaning jig accommodating section and the substrate placement section,
• the substrate placement section stacking the substrate on the cleaning jig so that the substrate stacked on the cleaning jig is provided as a pre-processing substrate, and
• the second transfer mechanism transferring the pre-processing substrate from the substrate placement section to a processing unit that carries out cleaning.

A substrate processing apparatus, comprising:

• a substrate placement section;
• a first transfer mechanism;
• and
• a second transfer mechanism,
• the second transfer mechanism unloading, from a processing unit, a substrate with a cleaning jig having been cleaned in the processing unit, as a post-processing substrate,
• the substrate placement section obtaining the post-processing substrate unloaded by the second transfer mechanism, and separating the post-processing substrate into the cleaning jig and the substrate,
• the first transfer mechanism transferring the substrate from the substrate placement section to a substrate accommodating section, and
• the second transfer mechanism transferring the cleaning jig from the substrate placement section to a cleaning jig accommodating section.