H10P 72/7604
The wafers being placed on a susceptor, stage or support
Official title: {the wafers being placed on a susceptor, stage or support}
H10P72/7604 (The wafers being placed on a susceptor, stage or support) appears on 6,979 US grants and 9,594 published applications in this corpus.
Search patents in H10P- Granted patents
- 6,979
- Published applications
- 9,594
- Assignees
- 1,209
- Inventors
- 14,243
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 0 | 0 |
| 1983 | 6 | 0 |
| 1984 | 6 | 0 |
| 1985 | 7 | 0 |
| 1986 | 8 | 0 |
| 1987 | 2 | 0 |
| 1988 | 8 | 0 |
| 1989 | 8 | 0 |
| 1990 | 8 | 0 |
| 1991 | 8 | 0 |
| 1992 | 18 | 0 |
| 1993 | 29 | 0 |
| 1994 | 27 | 0 |
| 1995 | 31 | 0 |
| 1996 | 24 | 0 |
| 1997 | 28 | 0 |
| 1998 | 48 | 0 |
| 1999 | 63 | 0 |
| 2000 | 82 | 0 |
| 2001 | 81 | 29 |
| 2002 | 77 | 101 |
| 2003 | 80 | 139 |
| 2004 | 96 | 137 |
| 2005 | 73 | 140 |
| 2006 | 62 | 143 |
| 2007 | 64 | 183 |
| 2008 | 61 | 242 |
| 2009 | 74 | 187 |
| 2010 | 120 | 227 |
| 2011 | 129 | 199 |
| 2012 | 157 | 226 |
| 2013 | 164 | 253 |
| 2014 | 181 | 266 |
| 2015 | 197 | 303 |
| 2016 | 195 | 351 |
| 2017 | 266 | 479 |
| 2018 | 330 | 596 |
| 2019 | 432 | 657 |
| 2020 | 514 | 761 |
| 2021 | 515 | 710 |
| 2022 | 546 | 827 |
| 2023 | 532 | 743 |
| 2024 | 579 | 633 |
| 2025 | 627 | 635 |
| 2026 | 403 | 427 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 72/7612Characterised by lifting arrangements1,741
- H10P 72/7624Characterised by the mechanical construction of the susceptor, stage or support1,624
- H10P 72/7618Characterised by a movable susceptor, stage or support, others than those only1,432
- H10P 72/7611Characterised by edge profile or support profile1,329
- H10P 72/7616Characterised by a coating, a hardness or a material962
- H10P 72/7614Characterised by a plurality of individual support members960
- H10P 72/7608Characterised by a plurality of separate clamping members867
- H10P 72/7626Characterised by the construction of the shaft842
Recent patents
- Substrate processing apparatus6 Oct 2026US 12,753,507 B2Tokyo Electron Limited
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Wafer processing method6 Oct 2026US 12,757,662 B2Disco Corporation
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Substrate handling apparatus for extreme warped wafers6 Oct 2026US 12,757,686 B2KLA Corporation
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Rotary electrical feedthrough integration for process chamber8 Oct 2026US 2026/0308750 A1APPLIED Materials.Inc.
- Reactant vapor delivery systems for semiconductor processing tools and methods8 Oct 2026US 2026/0308757 A1ASM IP Holding B. V.
- System and method to maintain constant clamping pressure during chamber rebooting and power failure instances8 Oct 2026US 2026/0311974 A1Lam Research Corporation
- Substrate processing method and substrate processing apparatus8 Oct 2026US 2026/0314296 A1SCREEN Holdings Co., Ltd.
Most cited
By later US patents
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Wafer support system670US 6,053,982 AASM America, Inc. · 2000
- Susceptor drive and wafer displacement mechanism660US 5,421,893 AAPPLIED Materials.Inc. · 1995
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995