H10P 72/7611
Characterised by edge profile or support profile
Official title: {characterised by edge profile or support profile}
H10P72/7611 (Characterised by edge profile or support profile) appears on 1,329 US grants and 1,835 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,329
- Published applications
- 1,835
- Assignees
- 348
- Inventors
- 3,705
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 8 | 0 |
| 1996 | 7 | 0 |
| 1997 | 7 | 0 |
| 1998 | 14 | 0 |
| 1999 | 20 | 0 |
| 2000 | 22 | 0 |
| 2001 | 21 | 6 |
| 2002 | 24 | 18 |
| 2003 | 10 | 27 |
| 2004 | 19 | 23 |
| 2005 | 8 | 31 |
| 2006 | 9 | 26 |
| 2007 | 15 | 31 |
| 2008 | 10 | 40 |
| 2009 | 14 | 31 |
| 2010 | 22 | 42 |
| 2011 | 18 | 27 |
| 2012 | 26 | 40 |
| 2013 | 27 | 47 |
| 2014 | 38 | 63 |
| 2015 | 42 | 45 |
| 2016 | 37 | 65 |
| 2017 | 47 | 100 |
| 2018 | 53 | 118 |
| 2019 | 92 | 140 |
| 2020 | 89 | 152 |
| 2021 | 102 | 164 |
| 2022 | 129 | 167 |
| 2023 | 101 | 143 |
| 2024 | 101 | 109 |
| 2025 | 111 | 102 |
| 2026 | 69 | 78 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus6 Oct 2026US 12,753,507 B2Tokyo Electron Limited
- Structures and methods for processing a semiconductor substrate22 Sep 2026US 12,742,237 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for processing a wafer8 Sep 2026US 12,733,448 B2Lam Research Corporation
- Substrate processing apparatus, susceptor assembly, method of manufacturing semiconductor device and substrate processing method1 Sep 2026US 12,727,438 B2Kokusai Electric Corporation
- Substrate support and substrate processing apparatus11 Aug 2026US 12,706,282 B2Tokyo Electron Limited
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Auxiliary ring in substrate processing apparatus8 Oct 2026US 2026/0314327 A1Samsung Electronics Co., Ltd.
- Defect inspection apparatus, substrate bonding apparatus, and defect inspection method1 Oct 2026US 2026/0305261 A1SCREEN Holdings Co., Ltd.
- Wafer transfer device24 Sep 2026US 2026/0293608 A1Nanya Technology Corporation
- Substrate supports for semiconductor processing systems17 Sep 2026US 2026/0282837 A1ASM IP Holding B. V.
Most cited
By later US patents
- Wafer support system670US 6,053,982 AASM America, Inc. · 2000
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995
- Process chamber with inner support569US 6,093,252 AASM America, Inc. · 2000
- Wafer holding, wafer support member, wafer boat and heat treatment furnace566US 7,204,887 B2Nippon Steel Corporation · 2007
- Gap maintenance for opening to process chamber562US 8,216,380 B2ASM America, Inc. · 2012