Apparatus for processing a wafer
AssigneeLam Research Corporation
InventorsMichael Brugger, Michael Puggl, Christian Putzi
Life of this patent
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Abstract
An apparatus for processing a wafer, the apparatus comprising: a rotatable chuck for receiving and rotating a wafer; a heating device arranged to heat a wafer received by the rotatable chuck; a plate that is transparent to radiation emitted by the heating device; and a plate holder that holds an outer periphery of the plate, so as to mount the plate in the plate holder; wherein the plate holder is mountable in the apparatus to position the plate between the heating device and a wafer when the wafer is received by the rotatable chuck.
Claims17
An apparatus for processing a wafer, the apparatus comprising:
- a rotatable chuck for receiving and rotating the wafer;
- a heating device arranged to heat the wafer received by the rotatable chuck;
- a plate that is transparent to radiation emitted by the heating device;
- and
- a plate holder that holds an outer periphery of the plate, so as to mount the plate in the plate holder,
- wherein
- the plate holder is mountable in the apparatus to position the plate between the heating device and the wafer when the wafer is received by the rotatable chuck, and
- the outer periphery of the plate is bevelled, chamfered, or stepped.
Dependencies are inferred from the claim text.