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US 12,727,438 B2Granted
Substrate processing apparatus, susceptor assembly, method of manufacturing semiconductor device and substrate processing method
AssigneeKokusai Electric Corporation
InventorsYasutoshi Tsubota, Takeshi Yasui, Tetsuaki Inada
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Abstract
According to one aspect of the technique in the disclosure, there is provided a substrate processing apparatus including: a process chamber in which a substrate is accommodated; a susceptor configured to support the substrate in the process chamber; and a susceptor cover provided on an upper surface of the susceptor, wherein the susceptor includes: a heating element; and a first through-hole located so as to avoid the heating element, and the susceptor cover includes a second through-hole communicating with the first through-hole and having a diameter greater than a diameter of the first through-hole.
Claims20
A substrate processing apparatus comprising:
- a process chamber in which a substrate is accommodated;
- a substrate support comprising:
- a susceptor at least comprising an upper surface portion and a lower surface portion, and configured to support the substrate in the process chamber, and
- a susceptor cover provided on an upper surface of the upper surface portion, made of material different from at least that of the upper surface portion and formed smaller than the susceptor;
- and
- a substrate lift pin,
- wherein the susceptor further comprises:
- a first through-hole penetrating the upper surface portion and the lower surface portion, and
- a heating element provided between the upper surface portion and the lower surface portion, and configured to heat the substrate,
- wherein the susceptor cover comprises a second through-hole communicating with the first through-hole and having a diameter greater than a diameter of the first through-hole, and the upper surface portion is partially exposed through the second through-hole,
- wherein the heating element is located so as to avoid but be directed toward the first through-hole, is folded back immediately before the first through-hole, and surrounds the first through-hole along an outer periphery of each folded-back portion of the heating element, and overlaps with a region vertically below the second through-hole,
- wherein the substrate lift pin is located so as to avoid an overlap with the heating element when viewed from vertically above the heating element, and is configured to be capable of supporting the substrate in a state where both of the first through-hole and the second through-hole are penetrated by an upper end of the substrate lift pin,
- wherein a diameter of the upper end of the substrate lift pin is smaller than that of the first through-hole, and
- wherein the substrate is placed on the susceptor cover to be heated by the heating element via the susceptor cover.
11 more elements
A susceptor assembly comprising:
- a susceptor configured to support a substrate and comprising an upper surface portion, a lower surface portion, a first through-hole penetrating the upper surface portion and the lower surface portion, and a heating element provided between the upper surface portion and the lower surface portion and configured to heat the substrate;
- and
- a susceptor cover made of material different from at least that of the upper surface portion, formed smaller than the susceptor, installed on an upper surface of the upper surface portion, and comprising:
- a second through-hole communicating with the first through-hole and having a diameter greater than a diameter of the first through-hole, wherein a surface of the upper surface portion is partially exposed through the second through-hole,
- wherein the heating element is located so as to avoid but be directed toward the first through-hole, is folded back immediately before the first through-hole, and surrounds the first through-hole along an outer periphery of each folded-back portion of the heating element, and overlaps with a region vertically below the second through-hole,
- wherein the substrate is placed on the susceptor cover to be heated by the heating element via the susceptor cover, and
- wherein the diameter of the second through-hole is equal to or greater than 1.5 times the diameter of the first through-hole and less than 2 times the diameter of the first through-hole.
4 more elements
Dependencies are inferred from the claim text.