Wafer transfer device

Abstract

A wafer transfer device comprises a first wall, a second wall, a third wall, a first supporting base, and a second supporting base. The second wall is substantially parallel to the first wall and spaces apart from each other in a first direction. The third wall is connected between the first wall and the second wall. The first supporting base is connected to a bottom of the first wall and extending toward the second wall. The first supporting base has a first contact surface. The second supporting base is connected to a bottom of the second wall and extending toward the first wall. The second supporting base has a second contact surface substantially coplanar with the first contact surface. Each of the first contact surface and the second contact surface has a width equal to or less than 6 mm in the first direction.

Dependencies are inferred from the claim text.