H10P 72/7624
Characterised by the mechanical construction of the susceptor, stage or support
Official title: {characterised by the mechanical construction of the susceptor, stage or support}
H10P72/7624 (Characterised by the mechanical construction of the susceptor, stage or support) appears on 1,624 US grants and 2,230 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,624
- Published applications
- 2,230
- Assignees
- 468
- Inventors
- 4,366
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 10 | 0 |
| 1996 | 10 | 0 |
| 1997 | 8 | 0 |
| 1998 | 12 | 0 |
| 1999 | 22 | 0 |
| 2000 | 36 | 0 |
| 2001 | 27 | 13 |
| 2002 | 38 | 37 |
| 2003 | 24 | 37 |
| 2004 | 29 | 30 |
| 2005 | 23 | 27 |
| 2006 | 15 | 26 |
| 2007 | 8 | 26 |
| 2008 | 11 | 39 |
| 2009 | 12 | 39 |
| 2010 | 20 | 38 |
| 2011 | 26 | 41 |
| 2012 | 24 | 47 |
| 2013 | 41 | 57 |
| 2014 | 28 | 39 |
| 2015 | 34 | 50 |
| 2016 | 47 | 81 |
| 2017 | 46 | 127 |
| 2018 | 74 | 128 |
| 2019 | 100 | 157 |
| 2020 | 121 | 188 |
| 2021 | 114 | 128 |
| 2022 | 117 | 185 |
| 2023 | 120 | 215 |
| 2024 | 118 | 160 |
| 2025 | 164 | 199 |
| 2026 | 111 | 116 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate handling apparatus for extreme warped wafers6 Oct 2026US 12,757,686 B2KLA Corporation
- Electrostatic chuck having extended lifetime29 Sep 2026US 12,751,248 B2APPLIED Materials.Inc.
- Substrate storing container and lid-body-side substrate support part22 Sep 2026US 12,745,597 B2Miraial Co., Ltd.
- Multi-wafer handling system22 Sep 2026US 12,745,602 B2Tel Manufacturing and Engineering of America, Inc.
- Wafer carrier assembly with improved temperature uniformity15 Sep 2026US 12,735,790 B2Veeco Instruments Inc.
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Rotary electrical feedthrough integration for process chamber8 Oct 2026US 2026/0308750 A1APPLIED Materials.Inc.
- Filament for heater pedestal8 Oct 2026US 2026/0314332 A1Lam Research Corporation
- Adjustable chuck for wafer bonding1 Oct 2026US 2026/0305258 A1Tokyo Electron Limited
- Substrate clamping device and substrate treatment appratus including the same24 Sep 2026US 2026/0293606 A1PSK Holdings Inc.
Most cited
By later US patents
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Wafer support system670US 6,053,982 AASM America, Inc. · 2000
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995
- Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment622US 4,821,674 A1989