Filament for heater pedestal
AssigneeLam Research Corporation
InventorSairam Sundaram
Life of this patent
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Abstract
Various embodiments herein relate to pedestals for semiconductor processing, as well as methods for their use and manufacture. In certain embodiments, a pedestal for supporting a semiconductor substrate during processing includes: a body having an inner portion and an outer portion surrounding the inner portion; an inner filament positioned in the inner portion of the body, the inner filament having a first temperature coefficient of resistance (TCR); and an outer filament positioned in the outer portion of the body, the outer filament having a second TCR, wherein the second TCR is different from the first TCR.
Claims19
A pedestal for supporting a semiconductor substrate during processing, the pedestal comprising:
- a body having an inner portion and an outer portion surrounding the inner portion;
- an inner filament positioned in the inner portion of the body, the inner filament having a first temperature coefficient of resistance (TCR);
- and
- an outer filament positioned in the outer portion of the body, the outer filament having a second TCR, wherein the second TCR is different from the first TCR.
A method of processing a substrate, the method comprising:
- receiving the substrate on a pedestal in a processing chamber, the pedestal comprising:
- a body having an inner portion and an outer portion surrounding the inner portion, the body having a top surface that contacts the substrate;
- an inner filament positioned in the inner portion of the body, the inner filament having a first temperature coefficient of resistance (TCR);
- an outer filament positioned in the outer portion of the body, the outer filament having a second TCR, wherein the second TCR is different from the first TCR;
- powering the pedestal to raise the pedestal to an elevated temperature;
- and
- processing the substrate at the elevated temperature.
A method of fabricating a pedestal for supporting a semiconductor substrate during processing, the method comprising:
- providing an inner filament having a first temperature coefficient of resistance (TCR);
- providing an outer filament having a second TCR, wherein the second TCR is different from the first TCR, and wherein both the inner filament and outer filament are configured to be powered together by a single power supply;
- providing a pedestal body;
- and
- sealing the inner filament and the outer filament in the pedestal body.
Dependencies are inferred from the claim text.