Substrate clamping device and substrate treatment appratus including the same

Abstract

The present invention relates to a substrate clamping device and a substrate treatment apparatus including the same, and more particularly, to a substrate clamping device that distributes and applies a pressing force for preventing warpage of a substrate and a substrate treatment apparatus including the same. According to an embodiment, it is possible to provide a substrate clamping device including: a supporting unit configured to support a substrate; a clamp ring that applies a load to a peripheral region of the substrate to prevent warpage of the substrate in a treatment process of the substrate; a driving unit that lifts the clamp ring; and a damping unit that distributes the load applied to the substrate by the clamp ring by lowering of the driving unit, wherein the damping unit includes: a clamp guide coupled to the driving unit to be lifted by the driving unit and having a damping groove at an upper end portion; a damping member coupled to the clamp guide to be operated integrally and provided inside the damping groove; and a damping guide inserted into the damping groove to be provided under the damping member and configured to press the clamp ring by distributing a pressing force of the damping member when the driving unit is driven to lower.

Dependencies are inferred from the claim text.