Multi-wafer handling system

A method, comprising:

• rotating a first pair of retention fingers of a first quartet of retention fingers to a first angular position, each retention finger configured to rotate about an axis at a proximal end and having a resting flexure at a distal end, wherein multiple quartets of retention fingers including the first quartet are mounted in a housing to which each of the retention fingers is respectively mounted at the axis;
• rotating a second pair of retention fingers of the first quartet to a second angular position, the second pair vertically spaced a first distance from a wafer;
• receiving the wafer through a passageway extending centrally through the housing and being open at a first end and a second end of the housing, the second pair being free of the passageway in the second angular position, the wafer being received from the first end and supported at a first side of the wafer by the resting flexures of the first pair, the second pair vertically located to face a second side of the wafer opposite the first side;
• after the first pair receives and supports the wafer, rotating the second pair to the first angular position;
• vertically moving the second pair towards the wafer over the first distance in the first angular position to hold the wafer at the second side by the resting flexures of the second pair and at the first side by the resting flexures of the first pair;
• and
• turning, using a bearing to which the housing is mounted, the housing to overturn the wafer 180 degrees when the wafer is held by the first quartet.

A wafer handling device, comprising:

• multiple quartets of retention fingers, each retention finger configured to rotate about an axis at a proximal end and having a resting flexure at a distal end, the resting flexure being vertically and torsionally compliant;
• a housing to which each of the retention fingers is respectively coupled via the axis;
• a passageway extending centrally through the housing and being open at a first end and a second end of the housing, the retention fingers having access to the passageway;
• a first pair of the retention fingers from a first quartet of the multiple quartets, the first pair configured to rotate to a first angular position to receive, in the passageway by the resting flexures of the first pair, a wafer at a first side of the wafer;
• a second pair of the retention fingers from the first quartet, the second pair configured to rotate to a second angular position free of the passageway before the first pair receives the wafer, and to rotate to the first angular position after the first pair receives the wafer, the second pair configured to vertically move towards the wafer in the first angular position, wherein the wafer handling device is configured to grip the wafer at a second side by the resting flexures of the second pair and at the first side by the resting flexures of the first pair;
• and
• a bearing to which the housing is mounted, the bearing for turning the housing to overturn the wafer by 180 degrees when the wafer is gripped by the first quartet.