H10P 72/7622
Characterised by supporting substrates others than wafers
Official title: {characterised by supporting substrates others than wafers, e.g. chips}
H10P72/7622 (Characterised by supporting substrates others than wafers) appears on 121 US grants and 148 published applications in this corpus.
Search patents in H10P- Granted patents
- 121
- Published applications
- 148
- Assignees
- 104
- Inventors
- 346
- Latest grant
- 19 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 5 |
| 2003 | 3 | 7 |
| 2004 | 3 | 8 |
| 2005 | 5 | 12 |
| 2006 | 3 | 11 |
| 2007 | 2 | 6 |
| 2008 | 4 | 8 |
| 2009 | 3 | 4 |
| 2010 | 6 | 5 |
| 2011 | 7 | 1 |
| 2012 | 5 | 0 |
| 2013 | 4 | 2 |
| 2014 | 1 | 6 |
| 2015 | 5 | 6 |
| 2016 | 5 | 6 |
| 2017 | 4 | 7 |
| 2018 | 6 | 10 |
| 2019 | 9 | 14 |
| 2020 | 9 | 7 |
| 2021 | 4 | 6 |
| 2022 | 4 | 1 |
| 2023 | 8 | 3 |
| 2024 | 1 | 6 |
| 2025 | 3 | 3 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device comprising a transferred portion of plurality of chips and method for manufacturing the same19 Aug 2025US 12,394,644 B2Innolux Corporation
- Bonding system and bonding method12 Aug 2025US 12,388,045 B2Bondtech Co., Ltd.
- Bonding system and bonding method25 Mar 2025US 12,261,147 B2Bondtech Co., Ltd.
- Apparatus for environmental control of dies and substrates for hybrid bonding4 Jun 2024US 12,001,193 B2APPLIED Materials.Inc.
- System and method for performing spin dry etching26 Dec 2023US 11,854,861 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Carrier for laser die transfer, wafer assembly, and pick and place apparatus comprising the same6 Aug 2026US 2026/0231730 A1Nexperia B. V.
- Recess-based pick and place for heterogeneous integration16 Jul 2026US 2026/0206525 A1ASML Netherlands B. V.
- Method of fabricating display device and apparatus for fabricating display device23 Apr 2026US 2026/0109142 A1Samsung Display Co., Ltd.
- Electronic package and a method for forming the same31 Jul 2025US 2025/0246477 A1JCET STATS ChipPAC Korea Limited
- Chip ejector apparatus29 May 2025US 2025/0174488 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications541US 6,528,767 B2APPLIED Materials.Inc. · 2003
- Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames72US 5,035,034 AMotorola, Inc. · 1991
- Method and apparatus for etching film layers on large substrates38US 5,895,549 AApplied Komatsu Technology, Inc. · 1999
- Package on package devices and methods of packaging semiconductor dies38US 9,171,790 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method for handling semiconductor die and the like36US 4,711,014 AVichem Corporation · 1987