Method and apparatus for etching film layers on large substrates

An apparatus for etching film layers on a plurality of substrates, comprising:

• an enclosure;
• a substrate support member including a plurality of planar substrate receiving surfaces thereon, wherein said support member is positionable in a first position wherein at least one of said planar substrate receiving surfaces is disposed in a horizontal position to receive a substrate thereon and further positionable in a second position, different than said first position, for etching a film layer on the substrate;
• and
• a clamp member selectively positionable with respect to at least one of said substrate receiving surfaces for engaging the substrate, said clamp member including a clamp ring and a spacer, said spacer providing a gap between said clamp ring and said substrate upon said substrate engagement.

An apparatus for etching film layers on a plurality of substrates, comprising:

• an enclosure;
• a substrate support member including a plurality of planar substrate receiving surfaces thereon, wherein said support member is positionable in a first position wherein at least one of said planar substrate receiving surfaces is disposed in a horizontal position to receive a substrate thereon and further positionable in a second position, different than said first position, for etching a film layer on the substrate;
• a clamp member selectively positionable with respect to at least one of said substrate receiving surfaces for engaging the substrate;
• and
• a plurality of lift pins disposed in said substrate support member, said lift pins being selectively engagable to move the substrate toward or away from said at least one of said substrate receiving surfaces.

An apparatus for etching film layers on a plurality of substrates, comprising:

• an enclosure;
• a substrate support member including a plurality of planar substrate receiving surfaces thereon, wherein said support member is positionable in a first position wherein at least one of said planar substrate receiving surfaces is disposed in a horizontal position to receive a substrate thereon and further positionable in a second position, different than said first position, for etching a film layer on the substrate;
• a clamp member selectively positionable with respect to at least one of said substrate receiving surfaces for engaging the substrate;
• and
• a clamp biasing member coupled to said clamp member and said substrate support member, said clamp biasing member including a housing disposed external to said substrate support member.

An apparatus for etching film layers on a plurality of substrates, comprising:

• an enclosure;
• a substrate support member including a plurality of planar substrate receiving surfaces thereon, wherein said support member is positionable in a first position wherein at least one of said planar substrate receiving surfaces is disposed in a horizontal position to receive a substrate thereon and further positionable in a second position, different than said first position, for etching a film layer on the substrate;
• and
• wherein said substrate receiving surfaces are nonparallel.

A method for positioning substrates on, and clamping substrates to, a substrate receiving surface disposed within a chamber having an enclosure wall and an access aperture through the enclosure wall, comprising:

• providing a plurality of lift pins selectively positionable with respect to the substrate receiving surface;
• providing a clamp ring having a clamp finger selectively positionable with respect to the substrate receiving surface;
• positioning the lift pins in a first position, wherein the lift pins are disposed completely within the substrate receiving surface;
• positioning the clamp ring in a first position, wherein the clamp finger is spaced from the substrate receiving surface;
• placing a substrate, disposed on a support blade, intermediate the substrate receiving surface and the clamp finger;
• moving the lift pins outwardly of the substrate receiving surface to lift the substrate from the support blade;
• retracting the support blade from the enclosure;
• and
• moving the clamp ring and the lift pins to position the substrate on the substrate receiving surface and to place the clamp finger in engagement with the substrate, the clamp ring maintaining a gap with the substrate.