Bonding system and bonding method

A bonding method of bonding each of a plurality of second articles to a first article, wherein

• each of the plurality of second articles is a chip comprising an uneven portion on a circumference closer to a bonding surface of the second article,
• the bonding method comprises:
• a step of transporting a second article in which the plurality of second articles are transported;
• and
• a bonding step of bonding the plurality of second articles to the first article by bringing the plurality of second articles into contact with the first article,
• in the step of transporting a second article, a portion opposite to the bonding surface on the uneven portion of at least one of the plurality of second articles is held by a holder for holding a second article, and the at least one second article is transported, and
• the holder for holding a second article comprises a sloped surface that comes into contact with only a lower end portion of the uneven portion of the at least one second article when holding the at least one second article.