Bonding system and bonding method

A bonding system that is a bonding system for bonding a second article to a first article, the bonding system comprising:

• an activation treatment device that comprises a particle beam source that activates a bonding surface of the second article by irradiating a bonding surface of the second article with a particle beam, and a radical source that activates the bonding surface of the second article by irradiating the bonding surface of the second article with a radical, the activation treatment of the bonding surface of the second article irradiated with the radical from the radical source following the activation treatment of the bonding surface of the second article irradiated with the particle beam from the particle beam source;
• and
• a bond device that brings the second article, of which the bonding surface is activated by the activation treatment device, into contact with the first article, to thereby bond the second article to the first article,
• wherein the activation treatment device places the second article in a posture in which the bonding surface of the second article faces vertically downward, and irradiates the bonding surface of the second article with the particle beam from the particle beam source positioned vertically below the second article, and following the irradiation, the activation treatment device reverses the second article to a posture in which the bonding surface of the second article faces vertically upward, and then irradiates the bonding surface of the second article with the radical from the radical source positioned vertically above the second article.