Package on package devices and methods of packaging semiconductor dies
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Yung Ching Chen, Chien-Hsun Lee, Jiun Yi Wu, Mirng-Ji Lii, Ming-Da Cheng
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Abstract
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.
Claims19
A method of packaging semiconductor dies, the method comprising:
- coupling a first die to a first substrate;
- coupling a plurality of metal stud bumps to the first substrate, each of the plurality of metal stud bumps including a stick region coupled to a surface of the first substrate and a ball region coupled to the stick region, the ball region and the stick region being a single continuous material, wherein the ball region has a larger width than the stick region;
- coupling a second die to a second substrate;
- forming a plurality of solder balls on the second substrate;
- and
- coupling each of the plurality of metal stud bumps on the first substrate to one of the plurality of solder balls on the second substrate, the coupling comprising reflowing the plurality of solder balls, wherein a material of the solder balls extends to form solder joints extending from the second substrate to the first substrate.
A method of packaging semiconductor dies, the method comprising:
- coupling a first die to a first substrate;
- coupling a plurality of metal stud bumps to the first substrate, each of the plurality of metal stud bumps including a first ball region coupled to a surface of the first substrate, a stick region coupled to the first ball region at a first end of the stick region, and a second ball region coupled to a second end of the stick region;
- coupling a second die to a second substrate;
- forming a plurality of solder balls on the second substrate;
- and
- coupling each of the plurality of metal stud bumps on the first substrate to one of the plurality of solder balls on the second substrate, wherein a material of the solder balls covers all sidewalls of the stick region such that the plurality of solder balls form a plurality of solder joints extending to the first substrate.
A method of packaging semiconductor dies, the method comprising:
- coupling a first die to a first substrate;
- disposing a window clamp over the first substrate, the window clamp comprising a window, a first aperture, and a second aperture formed therein, wherein the first substrate is exposed through the window of the window clamp,
- forming a plurality of metal stud bumps using the first aperture and the second aperture of the window clamp;
- coupling the plurality of metal stud bumps to the first substrate, each of the plurality of metal stud bumps including a stick region coupled to a surface of the first substrate and a ball region coupled to the stick region;
- coupling a second die to a second substrate;
- forming a plurality of solder balls on the second substrate;
- and
- coupling each of the plurality of metal stud bumps on the first substrate to one of the plurality of solder balls on the second substrate.
Dependencies are inferred from the claim text.