H10P 72/7608
Characterised by a plurality of separate clamping members
Official title: {characterised by a plurality of separate clamping members, e.g. clamping fingers}
H10P72/7608 (Characterised by a plurality of separate clamping members) appears on 867 US grants and 1,005 published applications in this corpus.
Search patents in H10P- Granted patents
- 867
- Published applications
- 1,005
- Assignees
- 297
- Inventors
- 2,037
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 9 | 0 |
| 1994 | 6 | 0 |
| 1995 | 8 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 12 | 0 |
| 1999 | 16 | 0 |
| 2000 | 12 | 0 |
| 2001 | 25 | 8 |
| 2002 | 13 | 24 |
| 2003 | 22 | 25 |
| 2004 | 25 | 26 |
| 2005 | 14 | 25 |
| 2006 | 10 | 16 |
| 2007 | 14 | 31 |
| 2008 | 11 | 41 |
| 2009 | 8 | 21 |
| 2010 | 14 | 29 |
| 2011 | 23 | 33 |
| 2012 | 23 | 25 |
| 2013 | 21 | 30 |
| 2014 | 24 | 39 |
| 2015 | 26 | 33 |
| 2016 | 31 | 40 |
| 2017 | 40 | 54 |
| 2018 | 38 | 53 |
| 2019 | 33 | 69 |
| 2020 | 61 | 61 |
| 2021 | 51 | 50 |
| 2022 | 39 | 69 |
| 2023 | 49 | 66 |
| 2024 | 58 | 56 |
| 2025 | 52 | 46 |
| 2026 | 43 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-wafer handling system22 Sep 2026US 12,745,602 B2Tel Manufacturing and Engineering of America, Inc.
- Substrate treating apparatus and substrate treating method18 Aug 2026US 12,713,867 B2Semes Co., Ltd.
- System and method for cleaning a wafer surface18 Aug 2026US 12,713,876 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chuck assembly18 Aug 2026US 12,713,877 B2Apet Co., Ltd.
- Substrate processing method and substrate processing apparatus11 Aug 2026US 12,707,936 B2Tokyo Electron Limited
- System and method for cleaning a wafer surface8 Oct 2026US 2026/0314325 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method thereof8 Oct 2026US 2026/0314326 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Movable rack system and operating method of the same1 Oct 2026US 2026/0305257 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer processing apparatus and wafer holding device thereof24 Sep 2026US 2026/0293607 A1ProAsia Semiconductor Corporation
- Wafer handling system and method3 Sep 2026US 2026/0262478 A1Service Support Specialties, Inc.
Most cited
By later US patents
- Apparatus for efficient removal of halogen residues from etched substrates558US 8,293,016 B2APPLIED Materials.Inc. · 2012
- Glass substrate-holding tool and method for producing an EUV mask blank by employing the same526US 8,967,608 B2Asahi Glass Company, Limited · 2015
- Apparatus for substrate holding515US 5,989,342 ADainippon Screen Mfg.Co., Ltd. · 1999
- Method and apparatus for drying substrates506US 5,884,640 AAPPLIED Materials.Inc. · 1999
- Substrate treatment method and substrate treatment apparatus473US 9,698,031 B2SCREEN Holdings Co., Ltd. · 2017