Wafer processing apparatus and wafer holding device thereof

A wafer holding device for holding a wafer, the wafer holding device comprising:

• a support platform comprising a first side and a second side opposite to each other;
• a plurality of holding assemblies arranged on the support platform, each of the plurality of holding assemblies comprising a base, a first magnetic element, and an elastic element, the base being movable relative to the support platform, the first magnetic element being disposed on the base, and two ends of the elastic element respectively abutting against the base and the support platform;
• and
• a driving unit comprising a movable element and at least one second magnetic element, the movable element being movable relative to the support platform, and the at least one second magnetic element being disposed on the movable element;
• wherein when the movable element approaches the second side of the support platform, the first magnetic element of each of the holding assemblies is driven by the at least one second magnetic element to bring the base of each of the holding assemblies to release the holding of the wafer and compress the elastic element;
• and wherein when the movable element moves away from the second side of the support platform, the base is driven to hold the wafer by an elastic restoring force of the elastic element of each of the holding assemblies.