Method and apparatus for drying substrates
AssigneeApplied Materials, Inc.
InventorsBoris Fishkin, John S. Hearne, Robert B. Lowrance
Life of this patent
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AssigneeApplied Materials, Inc.
InventorsBoris Fishkin, John S. Hearne, Robert B. Lowrance
Estimating the term…
A drying apparatus 20 for removing residual liquid from a substrate surface comprises a vapor chamber 25 having a vapor distributor 30 for introducing vapor into the chamber. The drying apparatus 20 further comprises a fluid system 35 comprising (i) a reservoir 40, (ii) a fluid dispenser 45 for introducing fluid into the reservoir, and (iii) a fluid level adjuster 50 for lowering a fluid surface level in the reservoir 40. A multi-point holder 62 is used for holding the substrate 55 at different holding points 63 on the substrate, while the fluid surface level is lowered relative to the substrate, so that residual liquid flows off the substrate surface without intersection of the lowering fluid surface level with holding points 63 on the substrate. The drying apparatus 20 dries substrates 55 substantially without forming stains or streaks, or causing contamination or liquid residue to remain on the substrate 55.
A drying chamber for drying a substrate surface having residual liquid thereon, the drying chamber comprising:
An apparatus for removing residual liquid on a substrate surface, the apparatus comprising:
A drying chamber for drying substrates having residual liquid thereon, the drying chamber comprising:
Dependencies are inferred from the claim text.