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US 12,713,867 B2Granted
Substrate treating apparatus and substrate treating method
AssigneeSemes Co., Ltd.
InventorsKwang Sup Kim, Seung Un Oh, Shin Hwa Kang, Sang Hyeon Ryu, Young Ho Park
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Abstract
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a body including an irradiation end, from which laser light is irradiated, a shaft coupled to the body, and a driver that supplies power to the shaft, the heating unit is swung about an axis of the shaft, and the controller moves the irradiation end of the heating unit to a target location on a substrate by adjusting a rotation angle of the heating unit and a rotation angle of the support unit.
Claims17
A substrate treating apparatus comprising:
- a support unit;
- a heating unit comprising:
- a body including an irradiation end, from which laser light is irradiated;
- a shaft coupled to the body;
- and
- a driver configured to supply power to the shaft,
- a controller configured to control movement of the heating unit, wherein the controller moves the irradiation end of the heating unit to a target location on a substrate by adjusting a rotation angle of the heating unit and a rotation angle of the support unit,
- wherein the target location includes an ideal target location, at which the target location is located when a center of the substrate and a center of the support unit coincide with each other, and an actual target location, at which the target location is located when the center of the substrate and the center of the support unit do not coincide with each other,
- wherein the controller calculates an error value between the ideal target location and the actual target location, and
- wherein the controller calculates a coordinate of the actual target location by applying the calculated error value to the actual target location.
7 more elements
Dependencies are inferred from the claim text.