H10P 72/7606
Characterised by edge clamping
Official title: {characterised by edge clamping, e.g. clamping ring}
H10P72/7606 (Characterised by edge clamping) appears on 566 US grants and 648 published applications in this corpus.
Search patents in H10P- Granted patents
- 566
- Published applications
- 648
- Assignees
- 232
- Inventors
- 1,653
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 18 | 0 |
| 2000 | 18 | 0 |
| 2001 | 25 | 2 |
| 2002 | 14 | 13 |
| 2003 | 15 | 15 |
| 2004 | 14 | 19 |
| 2005 | 5 | 8 |
| 2006 | 6 | 15 |
| 2007 | 6 | 10 |
| 2008 | 3 | 7 |
| 2009 | 7 | 11 |
| 2010 | 11 | 11 |
| 2011 | 9 | 10 |
| 2012 | 8 | 15 |
| 2013 | 8 | 12 |
| 2014 | 9 | 19 |
| 2015 | 11 | 23 |
| 2016 | 21 | 29 |
| 2017 | 16 | 32 |
| 2018 | 18 | 34 |
| 2019 | 31 | 35 |
| 2020 | 28 | 47 |
| 2021 | 22 | 58 |
| 2022 | 41 | 60 |
| 2023 | 36 | 58 |
| 2024 | 39 | 33 |
| 2025 | 42 | 43 |
| 2026 | 30 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer processing method6 Oct 2026US 12,757,662 B2Disco Corporation
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Multi-wafer handling system22 Sep 2026US 12,745,602 B2Tel Manufacturing and Engineering of America, Inc.
- Pocket heater with purge to improve gap tolerance15 Sep 2026US 12,735,789 B2APPLIED Materials.Inc.
- Flipping apparatus15 Sep 2026US 12,740,369 B2ACM Research (Shanghai) Inc.
- System and method to maintain constant clamping pressure during chamber rebooting and power failure instances8 Oct 2026US 2026/0311974 A1Lam Research Corporation
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for cleaning a wafer surface8 Oct 2026US 2026/0314325 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method thereof8 Oct 2026US 2026/0314326 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate clamping device and substrate treatment appratus including the same24 Sep 2026US 2026/0293606 A1PSK Holdings Inc.
Most cited
By later US patents
- Chemical vapor deposition chamber with a purge guide350US 5,516,367 AAPPLIED Materials.Inc. · 1996
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002
- Electro-chemical deposition system333US 6,258,220 B1APPLIED Materials.Inc. · 2001
- Physical vapor deposition clamping mechanism and heater/cooler313US 5,228,501 AAPPLIED Materials.Inc. · 1993
- In-situ electroless copper seed layer enhancement in an electroplating system310US 6,258,223 B1APPLIED Materials.Inc. · 2001