H10P 72/7616
Characterised by a coating, a hardness or a material
Official title: {characterised by a coating, a hardness or a material}
H10P72/7616 (Characterised by a coating, a hardness or a material) appears on 962 US grants and 1,482 published applications in this corpus.
Search patents in H10P- Granted patents
- 962
- Published applications
- 1,482
- Assignees
- 287
- Inventors
- 2,729
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 7 | 0 |
| 2000 | 11 | 0 |
| 2001 | 8 | 3 |
| 2002 | 5 | 7 |
| 2003 | 11 | 15 |
| 2004 | 8 | 19 |
| 2005 | 9 | 21 |
| 2006 | 3 | 20 |
| 2007 | 10 | 29 |
| 2008 | 12 | 39 |
| 2009 | 7 | 24 |
| 2010 | 21 | 18 |
| 2011 | 12 | 17 |
| 2012 | 12 | 17 |
| 2013 | 22 | 26 |
| 2014 | 16 | 23 |
| 2015 | 16 | 35 |
| 2016 | 19 | 36 |
| 2017 | 18 | 61 |
| 2018 | 33 | 81 |
| 2019 | 60 | 103 |
| 2020 | 70 | 148 |
| 2021 | 79 | 117 |
| 2022 | 110 | 127 |
| 2023 | 89 | 136 |
| 2024 | 91 | 124 |
| 2025 | 115 | 156 |
| 2026 | 76 | 80 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor manufacturing apparatus15 Sep 2026US 12,738,460 B2Toto Ltd.
- Wafer chuck apparatus with air member and method of fabricating a semiconductor device using the same15 Sep 2026US 12,740,371 B2Samsung Electronics Co., Ltd.
- Ceramic susceptor15 Sep 2026US 12,740,378 B2MiCo Ceramics Ltd.
- Member for semiconductor manufacturing apparatus8 Sep 2026US 12,733,425 B2NGK Insulators, Ltd.
- Apparatus for processing a wafer8 Sep 2026US 12,733,448 B2Lam Research Corporation
- Reactant vapor delivery systems for semiconductor processing tools and methods8 Oct 2026US 2026/0308757 A1ASM IP Holding B. V.
- Ceramic heater8 Oct 2026US 2026/0314333 A1NGK Insulators, Ltd.
- Support glass substrate and laminated substrate using same1 Oct 2026US 2026/0305256 A1Nippon Electric Glass Co., Ltd.
- Adjustable chuck for wafer bonding1 Oct 2026US 2026/0305258 A1Tokyo Electron Limited
- Lift pin holder assembly and apparatus24 Sep 2026US 2026/0293610 A1Lam Research Corporation
Most cited
By later US patents
- Substrate heat treatment apparatus555US 8,608,885 B2Dainippon Screen Mfg.Co., Ltd. · 2013
- Susceptors for semiconductor-producing apparatuses546US 6,645,304 B2NGK Insulators, Ltd. · 2003
- Susceptor546US 7,393,418 B2Covalent Materials Corporation · 2008
- Susceptor and semiconductor manufacturing apparatus including the same539US 8,323,413 B2LG Innotek Co., Ltd. · 2012
- Wafer support fixtures for rapid thermal processing533US 5,514,439 A1996