US 12,740,371 B2 · Wafer chuck apparatus with air member and method of fabricating a semiconductor device using the same

Abstract

A method of fabricating a semiconductor device comprises mounting a carrier substrate and a wafer on a wafer chuck of a wafer chuck apparatus, the carrier substrate and the wafer attached to each other, injecting air into an air member by selectively controlling at least one air injection pipe connected to the air member of the wafer chuck apparatus, tilting the wafer chuck to a predetermined angle in response to the air being injected into the air member, processing the wafer while the wafer chuck is tilted, determining whether to change a tilt angle of the wafer chuck or a position of the wafer, adjusting an amount of air injected into the air member according to a changed tilt angle of the wafer chuck or a changed position of the wafer, and processing the wafer after adjusting of the amount of air in the air member.

Claims12

Dependent claims

A wafer chuck apparatus comprising:

a rotatable support portion made of a metal material and having a circular upper surface;
a wafer chuck having a disk shape positioned on the rotatable support portion and having a plurality of vacuum channels therein;
an air member disposed between the rotatable support portion and the wafer chuck and connected to an external pump, the air member configured to extend in response to receiving a fluid from the external pump;
and
a hinge rotatably connecting the wafer chuck and the rotatable support portion to one another and connected to the plurality of vacuum channels at a center of a lower portion of the wafer chuck and connected to a vacuum pump through a vacuum suction pipe.

2 more elements

A wafer chuck apparatus comprising:

a rotatable support portion made of a metal material and having a circular upper surface;
a wafer chuck having a disk shape, positioned on the rotatable support portion, and having a plurality of vacuum channels therein;
an air member disposed between the rotatable support portion and the wafer chuck and connected to an external air pump;
and
a hinge rotatably connecting the rotatable support portion to the wafer chuck and connected to the plurality of vacuum channels at a center of a lower portion of the wafer chuck and connected to an external vacuum pump through a vacuum suction pipe,
wherein the air member comprises:
a base provided on the circular upper surface of the rotatable support portion;
an outer air holder connecting an edge of the base with an edge of the wafer chuck;
and
an inner air holder disposed around a central through hole surrounding the vacuum suction pipe on an upper surface of the base in a circumferential direction and connecting an upper surface of the base with a lower surface of the wafer chuck,
the outer air holder is provided in a shape of a circular pleated tube having a plurality of pleats, which connects the edge of the base with the edge of the wafer chuck, and
the inner air holder is provided in a shape of a circular pleated tube having a plurality of pleats.

9 more elements

Dependencies are inferred from the claim text.

Wafer chuck apparatus with air member and method of fabricating a semiconductor device using the same

Life of this patent

Wafer chuck apparatus with air member and method of fabricating a semiconductor device using the same

Life of this patent

Abstract

Claims12