H10P 72/7621
Characterised by supporting two or more semiconductor substrates
Official title: {characterised by supporting two or more semiconductor substrates}
H10P72/7621 (Characterised by supporting two or more semiconductor substrates) appears on 802 US grants and 1,057 published applications in this corpus.
Search patents in H10P- Granted patents
- 802
- Published applications
- 1,057
- Assignees
- 278
- Inventors
- 2,009
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 5 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 8 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 3 |
| 2002 | 9 | 7 |
| 2003 | 6 | 11 |
| 2004 | 6 | 5 |
| 2005 | 7 | 8 |
| 2006 | 5 | 9 |
| 2007 | 4 | 14 |
| 2008 | 4 | 16 |
| 2009 | 8 | 17 |
| 2010 | 8 | 29 |
| 2011 | 12 | 36 |
| 2012 | 21 | 46 |
| 2013 | 27 | 49 |
| 2014 | 28 | 40 |
| 2015 | 34 | 44 |
| 2016 | 31 | 59 |
| 2017 | 31 | 59 |
| 2018 | 34 | 67 |
| 2019 | 53 | 86 |
| 2020 | 61 | 65 |
| 2021 | 57 | 72 |
| 2022 | 51 | 101 |
| 2023 | 60 | 86 |
| 2024 | 64 | 65 |
| 2025 | 61 | 46 |
| 2026 | 36 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structures and methods for processing a semiconductor substrate22 Sep 2026US 12,742,237 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multi-wafer handling system22 Sep 2026US 12,745,602 B2Tel Manufacturing and Engineering of America, Inc.
- Wafer carrier assembly with improved temperature uniformity15 Sep 2026US 12,735,790 B2Veeco Instruments Inc.
- Substrate support unit, and apparatus and method for depositing a layer using the same15 Sep 2026US 12,740,377 B2Evatec AG
- Substrate processing apparatus8 Sep 2026US 12,733,451 B2SCREEN Holdings Co., Ltd.
- Movable rack system and operating method of the same1 Oct 2026US 2026/0305257 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing method and method of manufacturing semiconductor device using the same24 Sep 2026US 2026/0293542 A1Samsung Electronics Co., Ltd.
- Multl-station tool with rotatable top plate assembly10 Sep 2026US 2026/0271672 A1Lam Research Corporation
- Apparatuses and techniques for cleaning a multi-station semiconductor processing chamber6 Aug 2026US 2026/0229468 A1Lam Research Corporation
- Bottom purge for semiconductor processing system30 Jul 2026US 2026/0223622 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Rapid thermal processing apparatus for processing semiconductor wafers624US 5,444,217 AMoore Epitaxial, Inc. · 1995
- Gap maintenance for opening to process chamber562US 8,216,380 B2ASM America, Inc. · 2012
- Susceptor for MOCVD reactor551US 8,372,204 B2Cree, Inc. · 2013
- Susceptor546US 7,393,418 B2Covalent Materials Corporation · 2008
- Susceptor and semiconductor manufacturing apparatus including the same539US 8,323,413 B2LG Innotek Co., Ltd. · 2012