H10P 72/7614
Characterised by a plurality of individual support members
Official title: {characterised by a plurality of individual support members, e.g. support posts or protrusions}
H10P72/7614 (Characterised by a plurality of individual support members) appears on 960 US grants and 1,310 published applications in this corpus.
Search patents in H10P- Granted patents
- 960
- Published applications
- 1,310
- Assignees
- 316
- Inventors
- 2,656
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 9 | 0 |
| 1999 | 8 | 0 |
| 2000 | 13 | 0 |
| 2001 | 8 | 7 |
| 2002 | 15 | 12 |
| 2003 | 13 | 29 |
| 2004 | 16 | 24 |
| 2005 | 10 | 22 |
| 2006 | 11 | 19 |
| 2007 | 9 | 31 |
| 2008 | 9 | 33 |
| 2009 | 13 | 30 |
| 2010 | 20 | 30 |
| 2011 | 23 | 24 |
| 2012 | 19 | 38 |
| 2013 | 22 | 33 |
| 2014 | 31 | 42 |
| 2015 | 31 | 49 |
| 2016 | 24 | 37 |
| 2017 | 41 | 51 |
| 2018 | 49 | 91 |
| 2019 | 57 | 84 |
| 2020 | 64 | 91 |
| 2021 | 75 | 93 |
| 2022 | 68 | 104 |
| 2023 | 75 | 118 |
| 2024 | 74 | 83 |
| 2025 | 73 | 83 |
| 2026 | 55 | 52 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Electrostatic chuck having extended lifetime29 Sep 2026US 12,751,248 B2APPLIED Materials.Inc.
- Substrate storing container and lid-body-side substrate support part22 Sep 2026US 12,745,597 B2Miraial Co., Ltd.
- Multi-wafer handling system22 Sep 2026US 12,745,602 B2Tel Manufacturing and Engineering of America, Inc.
- Object holder, object table, method of controlling the shape of a surface, method of manufacturing the object holder, and their use in a lithographic method or apparatus1 Oct 2026US 2026/0299440 A1ASML Netherlands B. V.
- Electrostatic chuck17 Sep 2026US 2026/0282804 A1Toto Ltd.
- Support Plate for Localized Heating in Thermal Processing Systems10 Sep 2026US 2026/0271656 A1Beijing E-Town Semiconductor Technology Co., Ltd.
- Processing chamber and semiconductor processing equipment10 Sep 2026US 2026/0271670 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Substrate backside protection20 Aug 2026US 2026/0242942 A1Picosun Oy
Most cited
By later US patents
- Wafer support system670US 6,053,982 AASM America, Inc. · 2000
- Wafer holding, wafer support member, wafer boat and heat treatment furnace566US 7,204,887 B2Nippon Steel Corporation · 2007
- Electrostatic chuck and method of attracting wafer562US 5,777,838 AFujitsu Limited · 1998
- Substrate heat treatment apparatus555US 8,608,885 B2Dainippon Screen Mfg.Co., Ltd. · 2013
- Heat treatment apparatus551US 5,718,574 ATokyo Electron Limited · 1998