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US 5,777,838 AGranted
Electrostatic chuck and method of attracting wafer
AssigneeFujitsu Limited
InventorsKoki Tamagawa, Kojiro Takahashi, Takahiko Suzuki, Ryuichi Fukunishi
Life of this patent
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AssigneeFujitsu Limited
InventorsKoki Tamagawa, Kojiro Takahashi, Takahiko Suzuki, Ryuichi Fukunishi
Estimating the term…
An electrostatic chuck including an electrode having first and second surfaces, a dielectric member having a first layer for covering at least the first surface of the electrode, a power supply for conducting electric power to the electrode, and a cooling gas-feeding means for feeding a cooling gas onto the surface of the first layer of the dielectric member. A plurality of fine projections 28 are formed on the surface of the first layer of the dielectric member. Each of the fine projections 28 has a tip smaller than a root thereof so as to hold a wafer W in substantially a point-contact manner. The wafer can be held on the surface of the first layer of the dielectric member and cooled by the cooling gas fed from the cooling gas-feeding means.
An electrostatic chuck comprising:
An electrostatic chuck comprising an electrode having first and second surfaces, a dielectric member having first and second layers for covering the first and second surfaces of said electrode, means for conducting electric power to said electrode, and cooling gas-feeding means for feeding a cooling gas onto the surface of said first layer of said dielectric member, wherein said means for conducting electric power to said electrode comprises a metal terminal disposed in a hole formed in the second layer of said dielectric and is connected to said electrode, and a soft metal inserted in a molten state between said metal terminal and the wall of the hole formed in said second layer, and is hardened.
An electrostatic chuck comprising an electrode having first and second surfaces, a dielectric member having first and second layers for covering the first and second surfaces of said electrode, means for conducting electric power to said electrode, and cooling gas-feeding means for feeding a cooling gas onto the surface of said first layer of said dielectric member, wherein said means for conducting electric power to said electrode comprises a metal terminal disposed in a hole formed in the second layer of said dielectric member and is connected to said electrode, and a highly heat-conducting resin inserted between said metal terminal and the wall of the hole formed in said second layer, said heat-conducting resin including metal particles.
Dependencies are inferred from the claim text.