H10P 72/72
Using electrostatic chucks
Official title: using electrostatic chucks
H10P72/72 (Using electrostatic chucks) appears on 3,759 US grants and 4,836 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,759
- Published applications
- 4,836
- Assignees
- 518
- Inventors
- 6,574
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 10 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 18 | 0 |
| 1996 | 27 | 0 |
| 1997 | 32 | 0 |
| 1998 | 67 | 0 |
| 1999 | 57 | 0 |
| 2000 | 48 | 0 |
| 2001 | 53 | 25 |
| 2002 | 68 | 70 |
| 2003 | 58 | 75 |
| 2004 | 45 | 81 |
| 2005 | 49 | 83 |
| 2006 | 48 | 93 |
| 2007 | 29 | 82 |
| 2008 | 45 | 104 |
| 2009 | 41 | 91 |
| 2010 | 71 | 106 |
| 2011 | 65 | 96 |
| 2012 | 76 | 83 |
| 2013 | 74 | 143 |
| 2014 | 90 | 146 |
| 2015 | 122 | 173 |
| 2016 | 129 | 161 |
| 2017 | 153 | 224 |
| 2018 | 160 | 276 |
| 2019 | 203 | 322 |
| 2020 | 238 | 402 |
| 2021 | 256 | 381 |
| 2022 | 297 | 373 |
| 2023 | 291 | 387 |
| 2024 | 278 | 300 |
| 2025 | 310 | 338 |
| 2026 | 209 | 221 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Electrostatic chuck and related methods and structures6 Oct 2026US 12,757,679 B2Entegris, Inc.
- Arc current reduction from an electrostatic chuck6 Oct 2026US 12,757,680 B2APPLIED Materials.Inc.
- Member for semiconductor manufacturing apparatus6 Oct 2026US 12,757,681 B2NGK Insulators, Ltd.
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Rotary electrical feedthrough integration for process chamber8 Oct 2026US 2026/0308750 A1APPLIED Materials.Inc.
- Striker for wafer bonding8 Oct 2026US 2026/0314319 A1Tokyo Electron Limited
- Semiconductor processing tool and methods of operation8 Oct 2026US 2026/0314320 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer release mechanism8 Oct 2026US 2026/0314329 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Stage having electrostatic chuck and plasma processing apparatus using same921US 5,382,311 ATokyo Electron Limited · 1995
- Patterned susceptor to reduce electrostatic force in a CVD chamber810US 5,531,835 AAPPLIED Materials.Inc. · 1996
- Wafer spacing mask for a substrate support chuck and method of fabricating same799US 5,656,093 AAPPLIED Materials.Inc. · 1997
- Multi-zone resistance heater664US 6,740,853 B1Tokyo Electron Limited · 2004
- Micromachined silicon electrostatic chuck587US 5,583,736 AThe United States of America as represented by the Department of Energy · 1996