H10P 72/722
Details of electrostatic chucks
Official title: {Details of electrostatic chucks}
H10P72/722 (Details of electrostatic chucks) appears on 2,288 US grants and 2,882 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,288
- Published applications
- 2,882
- Assignees
- 359
- Inventors
- 4,331
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 8 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 8 | 0 |
| 1996 | 15 | 0 |
| 1997 | 24 | 0 |
| 1998 | 52 | 0 |
| 1999 | 40 | 0 |
| 2000 | 28 | 0 |
| 2001 | 33 | 13 |
| 2002 | 35 | 41 |
| 2003 | 33 | 41 |
| 2004 | 30 | 42 |
| 2005 | 22 | 34 |
| 2006 | 21 | 25 |
| 2007 | 11 | 31 |
| 2008 | 19 | 34 |
| 2009 | 14 | 36 |
| 2010 | 26 | 48 |
| 2011 | 24 | 33 |
| 2012 | 32 | 31 |
| 2013 | 31 | 79 |
| 2014 | 34 | 65 |
| 2015 | 66 | 95 |
| 2016 | 63 | 81 |
| 2017 | 87 | 130 |
| 2018 | 89 | 166 |
| 2019 | 122 | 199 |
| 2020 | 141 | 262 |
| 2021 | 175 | 253 |
| 2022 | 190 | 238 |
| 2023 | 196 | 270 |
| 2024 | 204 | 221 |
| 2025 | 228 | 252 |
| 2026 | 159 | 162 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Electrostatic chuck and related methods and structures6 Oct 2026US 12,757,679 B2Entegris, Inc.
- Arc current reduction from an electrostatic chuck6 Oct 2026US 12,757,680 B2APPLIED Materials.Inc.
- Member for semiconductor manufacturing apparatus6 Oct 2026US 12,757,681 B2NGK Insulators, Ltd.
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Rotary electrical feedthrough integration for process chamber8 Oct 2026US 2026/0308750 A1APPLIED Materials.Inc.
- Striker for wafer bonding8 Oct 2026US 2026/0314319 A1Tokyo Electron Limited
- Semiconductor processing tool and methods of operation8 Oct 2026US 2026/0314320 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate support and substrate processing apparatus1 Oct 2026US 2026/0302141 A1Tokyo Electron Limited
Most cited
By later US patents
- Micromachined silicon electrostatic chuck587US 5,583,736 AThe United States of America as represented by the Department of Energy · 1996
- Susceptors564US 6,160,244 ANGK Insulators, Ltd. · 2000
- Electrostatic chuck and method of attracting wafer562US 5,777,838 AFujitsu Limited · 1998
- Method and apparatus for dry etching and electrostatic chucking device used therein492US 4,384,918 AFujitsu Limited · 1983
- Electrostatic chunks486US 6,608,745 B2NGK Insulators, Ltd. · 2003