Member for semiconductor manufacturing apparatus

A member for semiconductor manufacturing apparatus, comprising:

• a ceramic plate having a wafer placement surface on its upper surface and a built-in electrode;
• a base plate provided on a lower surface of the ceramic plate;
• a base plate through-hole that penetrates the base plate in an up-down direction;
• an insulating tube inserted into the base plate through-hole;
• an adhesive agent pool provided in at least one of an inner circumferential surface of the base plate through-hole or an outer circumferential surface of the insulating tube, and disposed at a position down away from an upper surface of the insulating tube;
• and
• an adhesive layer including an insulating tube outer circumferential surface adhesion part formed from the lower surface of the ceramic plate to an intermediate point of the adhesive agent pool, and configured to bond the inner circumferential surface of the base plate through-hole and the outer circumferential surface of the insulating tube together.