Semiconductor processing tool and methods of operation

A method, comprising:

• determining a degree of warpage associated with a semiconductor substrate supported by an electrostatic chuck;
• determining, based on the degree of warpage, a vertical motion for an electrically-conductive pin;
• and
• causing a pin-positioning subsystem to move the electrically-conductive pin according to the vertical motion to position a tip of the electrically-conductive pin within a distance range from a backside surface of the semiconductor substrate.

A system, comprising:

• one or more memories;
• and
• one or more processors, coupled to the one or more memories, configured to:
• determine a degree of warpage associated with a semiconductor substrate supported by an electrostatic chuck;
• and
• cause, based on the degree of warpage, a pin-positioning subsystem to position an electrically-conductive pin relative to a region of the semiconductor substrate.