Substrate processing device and method for cleaning substrate processing device

A method for cleaning a substrate processing apparatus that comprises:

• a chamber;
• a substrate support positioned inside the chamber and configured to support a substrate;
• an edge frame having a groove in a lower surface thereof, disposed above the substrate support and extending outward from an edge of the substrate support;
• and a gas flow-controlling unit which comprises an insertion member protruding upward to be inserted into the groove and is installed on a side wall of the chamber to support the edge frame from below, the method comprising:
• lowering the substrate support to rest the edge frame on the gas flow-controlling unit;
• spraying a cleaning gas into the chamber;
• and
• allowing the cleaning gas to pass through a flow path which is provided in the gas flow-controlling unit to be positioned in a region that overlaps the edge frame.

A method for cleaning a substrate processing apparatus that comprises:

• a chamber;
• a gas spraying unit installed in the chamber;
• a substrate support installed inside the chamber to support a substrate at a position facing the gas spraying unit;
• an edge frame having a groove in a lower surface thereof and extending outward from an edge of the substrate support;
• and a gas flow-controlling unit which comprises an insertion member protruding upward to be inserted into the groove and is installed on a side wall of the chamber to be positioned between the side wall of the chamber and a side surface of the substrate support along a periphery of the substrate support, the method comprising:
• withdrawing, out of the chamber, the substrate supported on the substrate support;
• spraying a cleaning gas into the chamber by using the gas spraying unit;
• and
• allowing the cleaning gas to be discharged through a flow path which is provided in the gas flow-controlling unit to be positioned in a region that overlaps the edge frame.