H10P 72/06
Apparatus for monitoring, sorting, marking, testing or measuring
Official title: {Apparatus for monitoring, sorting, marking, testing or measuring}
H10P72/06 (Apparatus for monitoring, sorting, marking, testing or measuring) appears on 9,934 US grants and 12,591 published applications in this corpus.
Search patents in H10P- Granted patents
- 9,934
- Published applications
- 12,591
- Assignees
- 1,703
- Inventors
- 20,297
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 0 | 0 |
| 1984 | 5 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 17 | 0 |
| 1988 | 13 | 0 |
| 1989 | 19 | 0 |
| 1990 | 11 | 0 |
| 1991 | 14 | 0 |
| 1992 | 23 | 0 |
| 1993 | 32 | 0 |
| 1994 | 28 | 0 |
| 1995 | 29 | 0 |
| 1996 | 23 | 0 |
| 1997 | 30 | 0 |
| 1998 | 57 | 0 |
| 1999 | 106 | 0 |
| 2000 | 159 | 0 |
| 2001 | 170 | 92 |
| 2002 | 222 | 262 |
| 2003 | 271 | 370 |
| 2004 | 316 | 427 |
| 2005 | 265 | 366 |
| 2006 | 257 | 310 |
| 2007 | 192 | 317 |
| 2008 | 175 | 312 |
| 2009 | 146 | 301 |
| 2010 | 183 | 249 |
| 2011 | 220 | 230 |
| 2012 | 219 | 218 |
| 2013 | 194 | 247 |
| 2014 | 228 | 249 |
| 2015 | 195 | 330 |
| 2016 | 246 | 389 |
| 2017 | 310 | 490 |
| 2018 | 372 | 643 |
| 2019 | 538 | 798 |
| 2020 | 632 | 910 |
| 2021 | 680 | 853 |
| 2022 | 587 | 967 |
| 2023 | 677 | 897 |
| 2024 | 760 | 882 |
| 2025 | 764 | 904 |
| 2026 | 517 | 578 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 72/0604Process monitoring3,361
- H10P 72/0602Temperature monitoring2,617
- H10P 72/0606Position monitoring2,109
- H10P 72/0616Monitoring of warpages, curvatures, damages, defects or the like1,494
- H10P 72/0612Production flow monitoring1,137
- H10P 72/0618Using identification means413
- H10P 72/0611Sorting devices321
- H10P 72/0614Marking devices244
Recent patents
- Mitigation of capillary pattern collapse in supercritical dry6 Oct 2026US 12,757,666 B2Tokyo Electron Limited
- Plasma processing device and plasma processing method6 Oct 2026US 12,757,669 B2Hitachi High-Tech Corporation
- Substrate processing apparatus and substrate processing method6 Oct 2026US 12,757,674 B2Tokyo Electron Limited
- Rapid and precise temperature control for thermal etching6 Oct 2026US 12,757,675 B2Lam Research Corporation
- Substrate handling apparatus for extreme warped wafers6 Oct 2026US 12,757,686 B2KLA Corporation
- Method for predicting defect in semiconductor device8 Oct 2026US 2026/0309768 A1Samsung Electronics Co., Ltd.
- Prediction device and etching control system8 Oct 2026US 2026/0314298 A1Tokyo Electron Limited
- Method for fabricating a semiconductor device using heat treatment apparatus8 Oct 2026US 2026/0314299 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus8 Oct 2026US 2026/0314305 A1Ebara Corporation
- Semiconductor wafer processing tool with improved leak check8 Oct 2026US 2026/0314308 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Wafer processing cluster tool batch preheating and degassing apparatus663US 5,259,881 AMaterials Research Corporation · 1993
- Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support659US 6,847,014 B1Lam Research Corporation · 2005
- Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool656US 6,201,999 B1APPLIED Materials.Inc. · 2001
- Temperature control system for semiconductor process chamber652US 6,015,465 AAPPLIED Materials.Inc. · 2000
- Temperature control system for process chamber628US 6,326,597 B1APPLIED Materials.Inc. · 2001