Substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus for applying a filler to a gap between edge portions of substrates constituting a laminated substrate. The substrate processing apparatus for applying the filler (F) to the laminated substrate (Ws) having a first substrate (W1) and a second substrate (W2) bonded to each other, includes: a substrate holding device (2) configured to hold and rotate the laminated substrate (Ws); and a multi-nozzle head (20) configured to apply the filler (F) to a gap (G) between an edge portion (E1) of the first substrate (W1) and an edge portion (E2) of the second substrate (W2). The multi-nozzle head (20) includes a plurality of liquid jet nozzles (21) configured to emit the filler (F), and the plurality of liquid jet nozzles (21) are arranged along a rotation axis (Ct) of the substrate holding device (2).

Dependencies are inferred from the claim text.