H10P 72/0614
Marking devices
Official title: {Marking devices}
H10P72/0614 (Marking devices) appears on 244 US grants and 253 published applications in this corpus.
Search patents in H10P- Granted patents
- 244
- Published applications
- 253
- Assignees
- 139
- Inventors
- 589
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 14 | 0 |
| 2001 | 5 | 5 |
| 2002 | 11 | 17 |
| 2003 | 8 | 12 |
| 2004 | 12 | 17 |
| 2005 | 9 | 3 |
| 2006 | 11 | 17 |
| 2007 | 3 | 9 |
| 2008 | 4 | 10 |
| 2009 | 6 | 6 |
| 2010 | 10 | 7 |
| 2011 | 4 | 6 |
| 2012 | 4 | 4 |
| 2013 | 7 | 6 |
| 2014 | 4 | 3 |
| 2015 | 2 | 7 |
| 2016 | 6 | 7 |
| 2017 | 6 | 10 |
| 2018 | 6 | 11 |
| 2019 | 16 | 17 |
| 2020 | 13 | 21 |
| 2021 | 14 | 15 |
| 2022 | 11 | 14 |
| 2023 | 10 | 8 |
| 2024 | 8 | 10 |
| 2025 | 8 | 8 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of compensating die shift in the compression molding30 Jun 2026US 12,672,513 B2
- Inspection device and inspection method16 Jun 2026US 12,660,559 B2Hamamatsu Photonics K.K.
- Laser processing apparatus13 May 2025US 12,296,402 B2Disco Corporation
- Laser processing apparatus13 May 2025US 12,296,407 B2Disco Corporation
- High registration particles-transferring system13 May 2025US 12,297,538 B2Xerox Corporation
- Substrate marking apparatus and substrate marking method using the same8 Oct 2026US 2026/0314310 A1Samsung Electronics Co., Ltd.
- Method of optimizing laser marking path6 Aug 2026US 2026/0231778 A1Samsung Electronics Co., Ltd.
- Systems and methods for wafer overview image scan and pre-alignment of film frame carrier22 Jan 2026US 2026/0026294 A1
- Method for automatically generating chip identifiers for semiconductor dies in stacked structure, semiconductor device, and memory device using the same9 Oct 2025US 2025/0316608 A1Nanya Technology Corporation
- Method for automatically generating chip identifiers for semiconductor dies in stacked structure, semiconductor device, and memory device using the same9 Oct 2025US 2025/0316609 A1Nanya Technology Corporation
Most cited
By later US patents
- Semiconductor wafer edge marking561US 6,710,364 B2Texas Instruments Incorporated · 2004
- Wafer serialization manufacturing process for read/write heads using photolithography and selective reactive ion etching173US 6,806,035 B1Western Digital (Fremont), LLC · 2004
- Vacuum coupled tool apparatus for dry transfer printing semiconductor elements172US 8,261,660 B2Semprius, Inc. · 2012
- Method and system for calibrating a laser processing system and laser marking system utilizing same85US 7,015,418 B2GSI Group Corporation · 2006
- Apparatus for carrying semiconductor devices76US 6,078,845 ASchlumberger Technologies, Inc. · 2000