Method and system for calibrating a laser processing system and laser marking system utilizing same

In a laser based marking system for marking semiconductor substrates and the like, the system having a laser marker with a marking field which is substantially smaller than the substrate, a positioning subsystem having an X-Y stage for relatively positioning the marking field and the substrate, and an alignment vision subsystem separate from the marker for locating a feature on a substrate used to relatively position the substrate and marking field based on a location of the feature, a method for calibrating the system comprising:

• measuring a plurality of fiducials disposed on an alignment target with the alignment vision subsystem;
• calibrating the alignment vision subsystem based on the measured fiducials, the fiducials having predetermined locations;
• positioning the stage relative to the alignment target to calibrate the stage using data recording the movement of the stage and data obtained with the alignment vision subsystem, the calibration of the stage being performed subsequent to the step of calibrating the alignment vision system;
• positioning a test substrate to be marked;
• marking the substrate at a plurality of locations within the field to obtain marks;
• and measuring mark locations with a calibrated optical measurement system to obtain measurements and using the measurements to calibrate the laser marker wherein the system is calibrated.