Vacuum coupled tool apparatus for dry transfer printing semiconductor elements

A method of transferring a semiconductor element from a donor surface to a stamp transfer surface, said method comprising the steps of:

• providing a tool apparatus for dry transfer printing, said tool apparatus comprising:
• a top plate;
• a base plate;
• a mount capable of operationally connecting a transfer stamp to said base plate;
• and
• an actuator operationally connected to said top plate capable of controllably moving said top plate;
• attaching a transfer stamp to said base plate with said mount, wherein said stamp has a top surface that forms one surface of a pressurizable microchamber having an internal cavity that separates said transfer stamp from said top plate;
• providing a donor substrate surface comprising a semiconductor element;
• aligning said stamp transfer surface with said donor substrate surface;
• pressurizing said internal cavity thereby establishing conformal contact between said stamp transfer surface and said donor substrate surface, said semiconductor element, or both;
• decreasing said internal cavity pressure, wherein said decrease in internal cavity pressure is achieved by forming an air-tight seal around said micro-chamber cavity and increasing said cavity volume by activating said actuator to move said top plate in a direction that is away from said donor substrate, thereby transferring said semiconductor element from said donor surface to said stamp transfer surface.

A transfer printing tool comprising:

• a top plate;
• a stamp having a transfer surface, a top surface, and an elastomer layer supported by a stiff support layer, wherein said transfer surface corresponds to an external surface of said stamp and oriented in a direction opposite to the direction of said top surface for transfer printing from a donor substrate or to a receiving substrate;
• an antiflexural feature connected to said stiff support layer;
• a mount for securing said stamp to said top plate;
• and
• a microchamber having an internal cavity volume formed from said top plate and said stamp top surface, wherein said microchamber separates said transfer stamp from said top plate, said internal cavity volume having a variable and controllable volume by movement of said top plate, wherein movement of said top plate in a direction away from said stamp top surface increases said internal cavity volume and decreases pressure in said internal cavity volume, thereby moving said transfer surface in a direction away from said donor or receiving substrate.