Method of compensating die shift in the compression molding

A method of fabricating a compensated marked carrier for compensating a die shift of semiconductor dies in compression molding, comprising:

• providing a blank carrier;
• transforming original virtual carrier markings to compensated virtual carrier markings by applying a compensation factor in a computing apparatus;
• projecting the compensated virtual carrier markings onto the blank carrier for indicating locations of compensated projected markings on the blank carrier;
• and
• making physical carrier markings at the locations of the compensated projected markings on the blank carrier for forming the compensated marked carrier.

A panel-level semiconductor process to make semiconductor packages, comprising:

• compensating a die shift of semiconductor dies due to compression molding using a compensated marked carrier with a plurality of physical carrier markings, wherein
• the physical carrier markings are made according to compensated projected markings, wherein the compensated projected markings are calculated in a computing apparatus using original projected markings and a compensation factor,
• the original projected markings are generated by original virtual carrier markings through projection,
• the original virtual carrier markings are derived from an original green file;
• performing the compression molding to form a molding layer for encapsulating the semiconductor dies into a molded panel;
• releasing the molding panel from the compensated marked carrier and then transferring the molded panel onto a carrier plate;
• forming a circuit layer on a front side of the molded panel;
• forming a dielectric layer onto the circuit layer for encapsulating the circuit layer;
• removing a top portion of the dielectric layer to expose the circuit layer;
• forming an external connection layer coupled to the exposed circuit layer;
• and
• separating the molded panel, the circuit layer, the dielectric layer and the external connection layer into individual semiconductor packages;
• wherein the original projected markings and the compensated projected markings determine an original gap and a compensated gap respectively between two adjacent semiconductor dies, and
• wherein the die shift caused by the compression molding is compensated by changing the original gap to the compensated gap when bonding the semiconductor dies onto the compensated marked carrier.